NPI Wire Bond Process SME (Subject Matter Expert)

CG SEMI Pvt. Ltd. | Sanand, Ahmedabad, Gujarat

Experience: 510 Years

TA Code: 10401

Be Part of CG SEMI Journey Innovate. Collaborate. Lead the Future.

At CG SEMI, we are building Indias semiconductor assembly and testing capabilities for the world. We invite experienced semiconductor professionals to join our growing team and contribute to advanced package launches, process excellence, and next-generation semiconductor manufacturing.

Role Summary The NPI Wire Bond Process SME is responsible for leading end-to-end technical ownership of the wire bonding process during New Product Introduction (NPI) from customer technical alignment, machine readiness (4M), recipe development, qualification build support until mass production release.

The role ensures engineering excellence in wire bond process capability, yield improvement, equipment optimization, and APQP deliverables for new package launches.

Key Responsibilities

Process Ownership Wire Bond

- Define, optimize, and validate wire bonding process parameters (temperature, bond force, ultrasonic power, bonding speed, stitch profile).
- Lead characterization and recipe development for gold ball bonding, copper wire bonding, silver wire bonding, wedge bonding, fine pitch, low-k / ultra-low-k die, stacked die bonding, etc.
- Analyze and prevent bond-related defects (NSOP, weak bond, dog-ear, heel crack, cratering, lifted bond, stitch pull issues).
- Own wire bonding activities in NPI builds, from Engineering Lot Qual build Mass Production.
- Execute APQP deliverables (PFMEA, Control Plan, MSA/GR&R;, capability study, material qualification).
- Conduct 4M readiness assessment (Machine, Material, Method, Manpower) including tooling, capillary design, and bond finger evaluation.
- Collaborate with customer on technical discussions and resolve open items prior to qualification closure.

Wire Bond Machine / Material Management

- Lead machine evaluation, capillary selection, and consumable optimization.
- Perform FAT / SAT / CIQ for wire bond equipment.




- Drive cost reduction initiatives on wire material (Au/Cu/Ag), capillary life, and bonding cycle time (UPH).

Yield & Quality Improvement

- Lead root cause analysis (8D, DMAIC) on wire bond-related issues.
- Improve yield, reduce NSOP rate, lifted bonds, and unit fallout.
- Implement SPC / Process control strategies and ensure process stability.

Technical Skills Requirements

Category

Requirement

Wire Bond Tools

ASM Eagle / K&S; IConn / K&S; Asterion, Powernexx, RapidPro / H&K; or K&S; wedge bonder

Materials

Au/Cu/Al wire, capillary selection, leadframe/substrate design interface

Analysis

Ball shear test, Pull test, Cross-sectioning, SEM failure analysis

Software

SPC, DOE, Minitab/JMP, MS Office, MES (CIM/Smart Factory)

Methodology

APQP, PFMEA, Control Plan, GR&R;, Capability Study

Qualifications

- Bachelors degree in ECE, EE, ME, Materials Engineering, or equivalent.
- Minimum 510 years of Wire Bond engineering experience in Semiconductor Assembly / OSAT.
- Proven track record in NPI, package qualification, and customer technical discussion/closure.

Soft Skills

- Strong leadership, mentoring, and cross-functional coordination.
- Excellent communication and presentation skills (internal/external stakeholders).
- Ability to influence without authority in a fast-paced NPI environment.

To Explore the Chance Please share your updated resume along with:

- Full Name:
- Current Company:
- Current Designation:
- Current Location:
- Total / Relevant Experience:
- Qualification:
- Current Fixed CTC:
- Expected Fixed CTC:
- Notice Period:
- Open to relocate to Sanad : Yes / No

How to Apply Interested candidates are requested to mention TA Code: 10401 – NPI Wire Bond Process SME while applying and submit their updated resume through either of the following channels.

Google Form – Apply Now:

https://lnkd.in/dMrq2yQM

OR

Email: [email protected]

- TA Code: 10401

Make in India, for the World. Join CG SEMI and help shape the future of semiconductor manufacturing in India.TA Code: 10401

- Google Form: Apply Now: https://lnkd.in/dMrq2yQM

OR

Email: [email protected]

📌 NPI Wire Bond Process SME (Subject Matter Expert) (Ahmedabad)
🏢 CG Semi
📍 Ahmedabad