Senior Engineer - HPC (India)

Senior Engineer - HPC (India)

15 Oct
|
Larsen and Toubro
|
India

15 Oct

Larsen and Toubro

India

SECTION II: ROLE SUMMARY (Purpose of the Role)

Lead and manage the CAD Infrastructure function for LTSCT’s semiconductor chip design organization. The role is responsible for ensuring seamless availability of high-performance compute resources, licensing systems, data center infrastructure to support multiple R&D; design teams. The role spans across infrastructure setup, tool deployment, system administration, and data center operations, ensuring reliability, scalability and performance of engineering environments. The role also plays a key part in building and operationalizing in-house data center capabilities to support advanced chip design.

SECTION III: KEY RESPONSIBILITIES/ ACCOUNTABILITIES

CAD Tool Licensing & Installation

- Own the management of all CAD tool licenses ensuring tools are licensed, renewed on time, and available to support ongoing and upcoming chip design programs.
- Manage the installation and configuration of chip design tools on the compute infrastructure, ensuring tools are correctly set up and accessible to the R&D; teams.
- Evaluate alternate tool options available in the market and recommend cost effective alternatives where applicable.
- Work closely with the CAD Design team to identify and onboard current tools or capabilities where existing tools do not meet the evolving design requirements.

Compute & Infrastructure Support

- Set up and manage compute infrastructure required for chip design including high-performance servers, storage systems, CPUs, GPU based machines to support simulation and validation workloads.
- Manage the day-to-day compute infrastructure supporting chip design workloads including servers, data storage and high-load simulation environments.
- Provide continuous infrastructure support to R&D; teams during chip design operations, identifying and resolving issues related to tools, compute access, system performance and infrastructure availability that impact chip program timelines.





Data Center Build & Operations

- Support the planning, design, and implementation of LTSCT’s in-house data center infrastructure including architecture, configuration and commissioning based on current and future program requirements.
- Collaborate with cross functional teams including Procurement, Finance, and IT to evaluate, select, and deploy appropriate hardware ensuring alignment with performance, scalability, and cost objectives.
- Collaborate with external consulting partners engaged in data center design and setup, ensuring alignment with technical requirements and enabling knowledge transfer to internal teams.
- Contribute to establishing and operationalizing data center management processes, including capacity planning, resource allocation, system monitoring and performance optimization to ensure reliable support for high-load simulation and chip design activities.
- Ensure seamless transition from data center setup to steady-state operations by defining standard operating procedures, incident management protocols, and support models for ongoing infrastructure maintenance.

Operational Support & Service Delivery

- Act as a central support organization for all R&D; teams, ensuring infrastructure, tools, and environments are available prior to and during chip design execution.
- Ensure minimal disruption to design activities by proactively addressing infrastructure issues and maintaining high-system reliability.

SECTION IV: KEY INTERACTIONS

Internal Stakeholder

Purpose of Interaction

CAD Design Team





- Coordinate on tool requirements, evaluate alternate tool options, and ensure infrastructure support chip design operations.

R&D; Design Team

- Understand compute and infrastructure requirements, provide continuous support during chip design operations.

Procurement & Finance

- Collaborate on server procurement, vendor and budget management for the data center build-out.

External Stakeholder

Purpose of Interaction

External Data Center Consultants

- Manage the engagement for data center architecture, server configuration and commissioning.

Tool & Server Vendors

- Manage tool licensing agreements, server procurement, and technical support.

SECTION V: KNOWLEDGE & EXPERIENCE

KNOWLEDGE

Minimum Qualifications

- Bachelor’s / Master’s degree in Engineering (Computer Science, Electronics, or related field)

Language Skills

- English

EXPERIENCE

Years of Experience

- 5 to 8 years of relevant experience

Nature of

Experience

- Understanding of semiconductor chip design environment and tool ecosystems.
- Experience in CAD infrastructure within a semiconductor chip design organization.
- Hands-on experience managing chip design tool licensing, installation, and compute infrastructure in a chip design environment.
- Experience in data center build-out, architecture, or operations – including storage management, compute management, network management.

SECTION VI: TECHNICAL & LEADERSHIP / BEHAVIORAL SKILLS REQUIRED TO EXECUTE THE ROLE

SKILLS

Technical Skills
(if available)

- CAD Tool Licensing and Installation
- Compute Infrastructure
- Data Center Architecture and Operations
- Storage Management, Compute Management, Network Management, Security Management

Leadership / Behavioral Skills
(if available)

- Stakeholder Management
- Decision making
- Cross Functional Collaboration
- Ownership and Accountability

📌 Senior Engineer - HPC (India)
🏢 Larsen and Toubro
📍 India

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