Job Summary Join our team as a Silicon Packaging Design Engineer in the Data Center Group, where you will play a pivotal role in crafting cutting-edge silicon packaging solutions that drive Intel's innovation and technological leadership. In this role, you will be engaged in the end-to-end development of substrate designs, from concept to tapeout, ensuring optimized performance and manufacturability. Collaborating closely with cross-functional teams, your contributions will directly impact product quality, cost efficiency, and time-to-market for Intel's next-generation technologies.

This is an exciting prospect to start your career in a collaborative environment that fosters learning and professional growth.

Responsibilities

- Drive the complete development of substrate designs, starting from initial concept through tapeout.
- Perform physical layout and routing of package designs, ensuring adherence to design requirements.
- Conduct substrate fit and routing studies to establish optimal tradeoffs between design, performance, and cost.
- Collaborate with silicon and hardware teams to optimize silicon-package-board performance and pinout configurations.
- Define and implement substrate design rules to meet product and manufacturing requirements.
- Perform internal and external design reviews, analyze data, and resolve design rule violations (DRCs).
- Integrate design documentation and collateral into the product lifecycle management system.
- Continuously seek opportunities to improve package design for manufacturability (DFM) and quality assurance.

Qualifications Minimum Qualifications





- Diploma in Electronic/ Electrical Engineering or a related field.
- six months or more years of work experience in Semiconductor field related to design of silicon packaging or PCB.
- Novice to intermediate proficiency in substrate design and development, including physical layout and routing.
- Basic understanding of I/O fundamentals, package interconnect, and power delivery principles.
- Familiarity with design for manufacturability (DFM) and quality assurance processes.
- Strong problem-solving skills with a disciplined approach to execution.

Preferred Qualifications

- Preferred experience into E-CAD tool.
- Effective communication skills to convey technical information and collaborate with cross-functional teams.
- A proactive mindset to identify design improvement opportunities and ensure alignment with project goals.
- Passion for driving innovation and contributing to complex engineering challenges.

Job Type College Grad

Shift Shift 1 (India)

Primary Location India, Bangalore

Work Model This role will require an on-site presence.

Role: Design Engineer, Industry Type: Electronic Components / Semiconductors, Department: Production, Manufacturing & Engineering, Employment Type: Full Time, Permanent Role Category: Engineering Education UG: Any Graduate PG: Any Postgraduate Key Skills Skills highlighted with ‘‘ are preferred keyskills cad product lifecycle managementproduct qualitysemiconductorcompliancequality assurancemanufacturingrecruiterelectrical engineeringpackaging designcommunication skills

📌 Silicon Packaging Design Engineer (Bengaluru)
🏢 Intel
📍 Bengaluru