Wafer Bumping & Advanced Packaging Materials Supply Chain Lead The Wafer Bumping SCM Lead will be responsible for the end-to-end sourcing strategy, supplier selection, technical-commercial evaluation, procurement, qualification support, and lifecycle management of wafer bumping equipment, materials, and services. The role requires deep expertise in semiconductor equipment sourcing and strong knowledge of wafer bumping manufacturing technologies to enable informed sourcing decisions, supplier negotiations, technology benchmarking, and capacity planning.

The position will lead sourcing activities for greenfield factory setup, technology transfer, NPI, and high-volume manufacturing expansion while partnering closely with Process Engineering, Manufacturing, Facilities, Quality, and Finance teams.

Key Responsibilities

Equipment Strategy & Technology Selection

- Lead sourcing and selection of wafer bumping equipment and material.
- Develop equipment/material sourcing strategies aligned with technology roadmap and factory expansion plans.
- Support make-versus-buy and technology selection decisions through technical and commercial evaluations.
- Conduct supplier benchmarking and technology assessments across global OEMs.
- Drive RFQ, RFI, technical reviews, commercial negotiations, and supplier down-selection activities.

Equipment Categories Responsible for sourcing and qualification support of:

- Wafer Cleaning Systems
- Photoresist Coaters & Developers
- Lithography Steppers / Aligners
- Sputtering & UBM Deposition Systems
- Electroplating Equipment
- Ball Placement / Ball Drop Systems
- Reflow Furnaces
- Wafer Grinding Systems
- Wafer Dicing Systems
- AOI & Inspection Systems
- Metrology Equipment
- SEM / FA Equipment
- Reliability Test Equipment
- Material Handling & Automation Systems
- MES / Industry 4.0 Integration Interfaces





Supplier Management & Commercial Leadership

- Establish strategic partnerships with leading semiconductor equipment suppliers.
- Lead complex equipment contract negotiations covering:
- Pricing
- Installation
- Acceptance criteria
- Warranty
- Spare parts
- Service agreements
- Uptime guarantees
- Training packages
- Negotiate long-term framework agreements and capacity commitments.
- Drive supplier performance management through regular business reviews.

Semiconductor Process & Manufacturing Knowledge

Act as SCM technical counterpart to Engineering teams by understanding:

- Photolithography fundamentals
- UBM stack formation
- Sputtering technologies
- Electroplating processes
- Reflow mechanisms
- WLCSP process flow
- Fan-Out technologies
- Interposer technologies
- Wafer handling requirements
- Yield and reliability drivers

Hands-on process ownership is not required; however, strong understanding of process interactions and equipment requirements is essential.

Factory Setup & Capacity Planning

- Support greenfield fab setup and equipment deployment strategy.
- Develop equipment loading models and capacity planning scenarios.
- Evaluate throughput, OEE, utilization and ramp-up requirements.
- Coordinate factory readiness activities including:
- Utilities requirements
- Hook-up planning
- Installation schedules
- SAT/FAT planning
- Qualification readiness
- Support equipment relocation and technology transfer programs.

Strategic Sourcing & Cost Optimization





- Develop procurement strategy for CapEx investments.
- Drive multi-million-dollar equipment sourcing projects.
- Execute total cost of ownership analysis including:
- Purchase price
- Spare parts
- Service contracts
- Consumables
- Facility requirements
- Tool uptime
- Lead localization and alternate supplier development programs.

Required Qualifications

Education

Bachelor's or Master's Degree in:

- Mechanical Engineering, Electronics Engineering, Electrical Engineering, Semiconductor Engineering, Manufacturing Engineering, Supply Chain Management, Materials Science

Experience

SCM Lead

- >15 years semiconductor global sourcing and supply chain experience.
- Minimum 10 years in semiconductor equipment sourcing.
- Proven experience leading major CapEx sourcing projects exceeding USD 100M+.
- Experience supporting OSAT, IDM, wafer fabrication, advanced packaging, or semiconductor manufacturing environments.
- Strong experience with factory startup, technology transfer, or expansion projects.

Mandatory Technical Competencies

- Deep understanding of Wafer Bumping equipment technologies.
- Ability to evaluate tool specifications and compare competing OEM solutions.
- Robust knowledge of equipment acceptance criteria, FAT, SAT, and qualification processes.
- Understanding of SEMI standards, CE requirements, EHS and facility integration requirements.
- Experience reviewing:
- URS
- Technical specifications
- Tool layouts
- Utility matrices
- Throughput calculations
- Capacity models

Preferred Competencies

- Wafer bumping process knowledge.
- WLCSP technology understanding.
- Equipment engineering background.
- Greenfield semiconductor factory setup experience.
- Supplier ecosystem knowledge across the global semiconductor industry.

📌 Wafer Bumping & Advanced Packaging Materials Supply Chain Lead (Guwahati)
🏢 Tata Electronics
📍 Guwahati