Senior IC Packaging Engineer (Hyderabad)

Senior IC Packaging Engineer (Hyderabad)

20 Oct
|
Axiado
|
Hyderabad

20 Oct

Axiado

Hyderabad

About Axiado

Axiado is redefining how AI infrastructure gets secured and managed. Founded in 2019, we’re a fast-growing, well-funded team of over 180 people worldwide, building the Trusted Control/Compute Unit (TCU), a new class of semiconductor that integrates hardware security, real-time platform management, and AI-driven optimization. Our TCU-based Platform Efficiency Controller is shipping hardware that makes AI servers measurably more efficient, more secure, and more reliable, and we’re extending that foundation into a hardware-anchored management fabric that scales from a single board to the whole fleet.

Backed by robust funding and validated by commercial programs with Tier 1 industry leaders, Axiado has earned recognition through numerous industry awards, including the 2026 AI in Cybersecurity Innovation Award from TMCnet, a Diamond award for Zero Trust Solution of the Year at the 2026 Pinnacle Awards, and Gold at the 2026 Cybersecurity Excellence Awards for AI Security Solution,



as well as being a finalist for the Start-Up to Watch Award from the Global Semiconductor Alliance. We’re small enough that every person’s work visibly shapes the company, and we look for people who want to build, not just execute. Every employee holds equity, meaning your work directly builds your stake in the company’s future, not just a paycheck. If you want to help define what comes next, let’s talk.

Job Description

Axiado Corporation is seeking a Senior IC Packaging Engineer to provide technical leadership and architectural ownership of advanced IC and System-in-package(SiP) in a fast-growing startup environment. This role is designed for a senior technologist who combines deep hands-on expertise with system-level thinking, and who thrives in high-ambiguity, high-impact settings.

You will define and drive high-performance, low-power packaging architectures spanning 2D and RDL based fan-out (2.5D), chiplet-based designs, and heterogeneous integration, leading efforts from e

📌 Senior IC Packaging Engineer (Hyderabad)
🏢 Axiado
📍 Hyderabad

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