- 6+ years of hands‑on experience in package CAD layout and development.
- Strong experience with 2.5D / 3D IC packaging, FCBGA and advanced substrate‑based packages, multi‑die and chiplet‑based designs.
- Proficiency in industry‑standard tools such as: Cadence Allegro Package Designer (APD / SiP), Siemens Xpedition / Innovator 3D IC, or equivalent.
- Experience working with advanced manufacturing design rules and interface with OSATs.
- Valuable understanding of Signal Integrity (SI) and Power Integrity (PI) fundamentals and High‑Speed Design concepts.
- Strong communication, presentation, and documentation skills with the ability to work effectively in a team environment.