Staff Package Design Engineer (Bengaluru)

Staff Package Design Engineer (Bengaluru)

21 Oct
|
Ram Associates
|
Bengaluru

21 Oct

Ram Associates

Bengaluru

Qualifications

Minimum Qualifications

- 6+ years of hands‑on experience in package CAD layout and development.

- Strong experience with 2.5D / 3D IC packaging, FCBGA and advanced substrate‑based packages, multi‑die and chiplet‑based designs.

- Proficiency in industry‑standard tools such as: Cadence Allegro Package Designer (APD / SiP), Siemens Xpedition / Innovator 3D IC, or equivalent.

- Experience working with advanced manufacturing design rules and interface with OSATs.

- Positive understanding of Signal Integrity (SI) and Power Integrity (PI) fundamentals and High‑Speed Design concepts.

- Strong communication, presentation, and documentation skills with the ability to work effectively in a team environment.

Pay: ₹100,000.00 - ₹300,000.00 per month

Work Location: In person

📌 Staff Package Design Engineer (Bengaluru)
🏢 Ram Associates
📍 Bengaluru

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