Semiconductor Industry :

Senior Assembly Process Engineer (or Manager)

Responsibilities

1. Responsible for semiconductor assembly process development, mass production support, and yield improvement for Wafer Backside Grinding, Wafer Saw/Dicing and Die Pick / Pick & Place (PnP) processes.
2. Develop and maintain SOPs, Control Plans, PFMEAs, OCAPs, Process Specifications, and other related engineering documentation.

3. Participate in equipment selection, installation, qualification, and mass production ramp-up for Grinding, Dicing, and Die Pick / Pick & Place equipment according to project requirements.
4. Proficiency in reading and writing technical documents in English, with effectively.

Desired Skills Minimum 4 years of experience in semiconductor assembly and/or wafer-level processes.

Hands-on mass production experience in at least two of the following processes: BG/dicing/PnP

- Robust knowledge of semiconductor assembly process flows.

If you are from semiconductor industry and having hands on experience in OSAT , please reach out at [email protected].

📌 Process Engineer in Semiconductor Industry (Noida)
🏢 Bradford Consultants
📍 Noida