About Marvell

Marvell s semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. Across enterprise, cloud and AI, and carrier architectures, our innovative technology is enabling new possibilities.

Your Team, Your Impact

The Marvell Advanced Packaging team is responsible for package designs
that meet challenging electrical requirements. High speed signaling and challenging power delivery networks require complex and custom solutions to meet constantly advancing application needs. Many of the new designs require multi-chip and multiple component configurations with high-speed IP requirements. In addition, our team is advancing Marvells expertise in 3D packaging, Co-packaged optics and cutting-edge substrate materials. We work with the worlds leading manufacturers to solve our clients most challenging designs and integrations with industry-leading packaging techniques.

What You Can Expect

What You Can Expect

- Marvell s Central Engineering team is seeking a talented High-speed IC package development engineer to contribute to the development of advanced microelectronic packages.
- The engineer will be responsible for driving microelectronic package development from concept through tapeout, working with package architects and technical leads to select appropriate technologies and ensure manufacturability, performance, reliability, and cost compliance.

What Were Looking For

What Were Looking For

- 4+ years of related professional experience.

- Proficiency with industry-standard IC package layout tools such as Cadence APD or Siemens (Mentor) Xpedition (XPD)
- Strong understanding of IC package design requirements for high-speed interfaces, including constraints definition and implementation
- Experience collaborating with substrate suppliers, OSATs, and silicon fabrication partners to drive successful design execution
- Expertise in power plane design,



including translating system-level power delivery requirements into optimized package solutions
- Knowledge of IC packaging technologies, materials, substrate design rules, and assembly constraints
- Experience supporting new product introduction (NPI) from concept through development and production is a plus
- Ability to collaborate with ASIC physical design teams to optimize die floorplan for improved package integration and system performance is a plus
- Knowledge of 2D, 2. 5D, and emerging packaging architectures such as CoWoS-S/R/L, EMIB, CPO, and CPC.
- High-level understanding of thermal and mechanical package constraints (e. g. , warpage, TIM).
- Experience contributing to tool, process, and flow development, including library maintenance and basic scripting for automation.
- Familiarity with foundry design rules and substrate manufacturing constraints.
- Demonstrated ability to work across cross-functional teams and global time zones; strong interpersonal skills and willingness to learn.

This role is eligible to participate in Marvells bonus and equity plans, including a new hire equity grant and annual equity refreshers, ensuring you are rewarded for your contributions and remain invested in the companys long-term success.

Additional Compensation and Benefit Elements

With competitive compensation and great benefits, you will enjoy our workstyle within an setting of shared collaboration, transparency, and inclusivity.



We re dedicated to giving our people the tools and resources they need to succeed in doing work that matters, and to grow and develop with us. For additional information on what it s like to work at Marvell, visit our Careers page.

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, national origin, sexual orientation, gender identity, disability or protected veteran status.

Interview Integrity

To support fair and authentic hiring practices, candidates are not permitted to use AI tools (such as transcription apps, real-time answer generators like ChatGPT or Copilot, or automated note-taking bots) during interviews.

These tools must not be used to record, assist with, or enhance responses in any way. Our interviews are designed to evaluate your individual experience, thought process, and communication skills in real time. Use of AI tools without prior instruction from the interviewer will result in disqualification from the hiring process.

This position may require access to technology and/or software subject to U. S. export control laws and regulations, including the Export Administration Regulations (EAR). As such, applicants must be eligible to access export-controlled information as defined under applicable law. Marvell may be required to obtain export licensing approval from the U. S. Department of Commerce and/or the U. S. Department of State. Except for U. S. citizens, lawful permanent residents, or protected individuals as defined by 8 U. S. C. 1324b(a)(3), all applicants may be subject to an export license review process prior to employment.

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Disclaimer: This job posting has been aggregated from external source. Role details, content, and availability are subject to change. Applicants are advised to confirm the latest information directly on the company website before applying.

📌 Package Layout Design Staff/Sr Staff Engineer (Bengaluru)
🏢 Marvell Semiconductors
📍 Bengaluru