23 Oct
|
Hyundai MOBIS
|
Hyderabad
23 Oct
Hyundai MOBIS
Hyderabad
Prepare pre and post-layout reports demonstrating critical interfaces guarantee robust Signal /Power Integrity and EMC analysis
- EMC (SI/PI/EMI) analysis for High Power and High Current multi-layer PCB.
- Power Integrity (DC drop, Decoupling, Resonance), SSN, Near & Far field analysis
- Signal Integrity (Reflection, Crosstalk & Timing) analysis for High Speed multi-layer PCB
Prepare pre and post-layout reports demonstrating critical interfaces guarantee robust Signal /Power Integrity and EMC analysis
- EMC (SI/PI/EMI) analysis for High Power and High Current multi-layer PCB.
- Power Integrity (DC drop, Decoupling, Resonance), SSN, Near & Far field analysis
- Signal Integrity (Reflection, Crosstalk & Timing) analysis for High Speed multi-layer PCB
📌 EMI/EMC Simulation (Hyderabad)
🏢 Hyundai MOBIS
📍 Hyderabad