About Us:
Tessolve offers a unique combination of pre-silicon and post-silicon expertise to provide an efficient
turnkey solution for silicon bring-up, and spec to the product. With 3200+ employees worldwide,
Tessolve provides a one-stop-shop solution with full-fledged hardware and software capabilities,
including its advanced silicon and system testing labs.
Tessolve offers a Turnkey ASIC Solution, from design to packaged parts. Tessolve's design services
include solutions on advanced process nodes with a healthy eco-system relationship with EDA, IP,
and foundries. Our front-end design strengths integrated with the knowledge from the backend flow,
allows Tessolve to catch design flaws ahead in the cycle, thus reducing expensive re-design costs,
and risks. We actively invest in the R&D; center of excellence initiatives such as 5G, mmWave,
Silicon photonics, HSIO, HBM/HPI, system-level test, and others. Tessolve also offers end-to-end
product design services in the embedded domain from concept to manufacturing under an ODM
model with application expertise in Avionics, Automotive, Industrial and Medical segments.
Tessolve's Embedded Engineering services enable customers a faster time-to-market through deep
domain expertise, innovative ideas, diverse embedded hardware & software services, and built-in
infrastructure with world-class lab facilities.
Tessolve's clientele includes Tier 1 clients across multiple market segments, 9 of the top 10
semiconductor companies, start-ups, and government entities. We have a global presence over 12
countries with office locations in the United States, India, Singapore, Malaysia, Germany, United
Kingdom, Canada, UK, Japan, Taiwan, Philippines, and Test Labs in India, Singapore, Malaysia,
Austin, San Jose.
For more details, visit www.tessolve.com/
Job Overview
Job Description:




Tessolve develop complete embedded platform from idea to product, providing unique end
to end solution to its end customers
In Tessolve Embedded Business Unit, you will be in charge of the architecture and technical
team coordination of embedded electronics systems including electronics, mechanical,
FPGA, SW and FW
A significant experience in embedded electronics with a strong leadership / ownership
capability to drive the team to the technical solution is expected
If you are self-motivated and looking for a recent challenge in your carrier, this job may be
done for you
Experience:
Bachelor's degree or higher in Electronics Engineering, Communication Engineering,
Electrical Engineering
>8 years of proven industrial experience in Hardware Design and Development and
Hardware Platform Architect.
Experience in Digital design related to Microprocessors/ Microcontrollers, DSP, FPGAs,
Oscillators, Memories, ADC, DACs, Op-Amps High/Low side drivers, clock circuits, etc
Experience in design and testing of Memory interfaces like DDR3, DDR4/LPDDR4,
LPDDR5/6, UFS, eMMC
Experience in designing and testing of high-speed interfaces like MIPI, HDMI, DVI, PCIe
Gen2/3/4/5/6, USB3.0/3.1, LVDS, Ethernet, etc
Experience in designing and testing interface for all type of peripherals e.g. I2C, SPI, RS 232/422, RS-485, CAN, etc.).
Experience in Circuit analysis like power budget, DC drop, tolerance, Derating, thermal etc




Experience working in hardware development, bring up, debug and validation
Tessolve - A Hero Electronix Venture | www.tessolve.com
Experience working on high-speed board design
Exposure to Power integrity, Signal Integrity, Thermal Analysis, Warpage Analysis
Exposure on designing power delivery solutions for various chipsets.
Experience in Thermal design and knowledge of EMI/EMC filter design and ESD.
Able to develop test procedures and test the electronics circuit
Exposure in Regulatory compliance testing (EMI/EMC, Wireless Tests) - CE/FCC
Experience using high end scopes (16GHz /70GHz), DDR4/5 compliance testing, logic
analyser, Signal Generator and appropriate tools required for board debug
Experience with tools for hardware version control and bug tracking
Soft Skills:
Self-Motivated
Ownership
Leadership
Strong analytical and problem-solving skills with ability to work independently
Should be able to co-ordinate with various cross-functional teams like: Schematics, PCB
Design, Simulation, Mechanical, SCM, BSP, Firmware development, Application
Development teams.
Strong verbal communication and presentation skills
Experience in handling customer communication
Tessolve Semiconductor Private Limited, as well as its affiliates and subsidiaries ("Tessolve") does
not require job applicants to make any payments at any stage of the hiring process. Any request for
payment in exchange for a job opportunity at Tessolve is fraudulent and should be ignored. If you
receive any such communication, we strongly advise you to refrain from making any payments and
to promptly report the incident to us at [email protected] . Tessolve is not responsible for any losses
incurred due to such fraudulent activitie

📌 Hardware Design (Bengaluru)
🏢 TalentOla
📍 Bengaluru