JD Code: JD-EMDE-SR

Job Title: Electro-Mechanical Design Engineer – Packaging & System Integration

Location: Hybrid / Work From Home

Salary: 50k – 85k per month based on skill & experience

Work Start Time: 11 am IST for Europe clients, 1 PM IST for US clients

Employment Type: Full-time

Job SummaryWe are looking for an Electro-Mechanical Design Engineer experienced in electronics packaging, enclosure design, and electromechanical system integration.

The role involves taking functional prototypes (energy module blocks, capacitor banks, control electronics, DC-DC converters, and battery systems) and transitioning them into compact, manufacturable, and production-ready 3D CAD assemblies. You will be responsible for end-to-end mechanical packaging, thermal management (forced-air/fan cooling), structural calculations, and 3D wire harness routing while preparing designs for physical prototyping and regulatory certification.

The candidate must bridge the gap between mechanical and electrical engineering, possessing strong 3D CAD packaging skills, a practical understanding of DC power architecture, and a solid grasp of Design for Manufacturing (DFM).

Key Responsibilities1. Electro-Mechanical Packaging & Casing Design

- Execute 3D packaging and assembly design for power electronics, including a complete controller + DC-DC package, energy module casings, and high-voltage battery integration.
- Package distributed capacitor bank PCBs into compact, sealed, and integrated modular enclosures.
- Transition bench-top wiring setups into compact, production-grade control box enclosures designed to house integrated carrier PCBs, control units, relays, power resistors, and sensing hardware.
- Design and refine structural casings for energy module blocks, ensuring ease of manufacturing, structural integrity, and proper force distribution.
- Perform mechanical force calculations, tolerance stack-up analysis, and structural evaluations to validate enclosure durability under operational loads.

2. Electrical Routing, Wiring & Component Integration

- Model and integrate electrical components (microcontrollers, ESP32/STM modules,



IVT-S sensors, power relays, DC-DC converters, and safety stop switches) within 3D CAD assemblies to define packaging envelopes and clearance limits.
- Plan and route high-current and low-voltage cable harnesses, CAN bus lines, and inter-module parallel connections in 3D CAD to optimize packaging space and accurately define cable lengths.
- Minimize cable clutter by consolidating loose, point-to-point wiring into modular interconnects, busbars, and centralized PCB-mounted configurations.
- Ensure proper isolation, creepage, and clearance between high-voltage DC components (0–100V DC / 60V DC battery circuits) and low-voltage control/sensing circuitry.

3. Thermal Management & Environmental Protection

- Design and integrate active air-cooling and fan-cooling systems (fans, ducting, vents, and heat sinks) to dissipate heat from power resistors, DC-DC units, and capacitor banks.
- Perform basic thermal and airflow calculations to prevent hotspot formation and ensure thermal reliability without the need for liquid cooling.
- Design enclosures to meet targeted ingress protection (IP) ratings, shielding sensitive electronics from dust, moisture, and environmental conditions.

4. DFM, Prototyping & Certification Readiness

- Apply Design for Manufacturing (DFM) and Design for Assembly (DFA) principles across sheet metal, CNC-machined, extruded, or molded enclosures.
- Prepare comprehensive 2D manufacturing drawings, BOMs (Bill of Materials), cable schedules, assembly procedures, and fabrication files.
- Prepare packaging designs to meet international safety and compliance certification standards (CE, UL, low-voltage directives, EMC/EMI shielding guidelines).




- Coordinate with fabrication vendors and multidisciplinary engineering teams to deliver verified, prototype-ready designs and hardware for testing targeted for mid-Q1 2027.

Candidate Qualifications & Skill Requirements

- Education: B.E. / B.Tech / M.Tech in Mechanical Engineering, Mechatronics, Electrical & Electronics Engineering, or a related discipline.
- Experience: 4–6+ years of hands-on experience in electro-mechanical packaging, electronic enclosure design, power electronics integration, or mechatronic product development.
- CAD Proficiency: Advanced proficiency in 3D CAD (SolidWorks, PTC Creo, or Autodesk Inventor), including sheet metal design, structural framing, assembly modeling, and 3D electrical routing/harnessing modules.
- Electrical System Understanding: Practical understanding of DC power distribution, rectification (AC to DC), DC-DC converters, capacitor banks, battery storage integration, relays, and microcontroller packaging (STM32, ESP32, Arduino).
- Thermal Design: Practical experience designing forced-air cooling systems, fan selection, ducting, and passive heat sink integration for power electronics.
- Manufacturing Knowledge: Deep knowledge of sheet metal fabrication, machining, mounting hardware, gasketing/sealing, and wire harness assembly.
- Codes & Compliance: Familiarity with IP ratings, electrical creepage/clearance standards, UL/CE packaging guidelines, and vibration/shock resistance considerations.
- Communication: Strong English written and verbal communication skills with experience collaborating with remote international teams (Europe/US) and external manufacturing suppliers.

Advantages

- 5 lakh personal health insurance cover
- Performance-based incentive program with up to 24% monthly bonus (Implementation in process. Terms and conditions apply)
- Rs. 1000/- reimbursement on gym membership and other regular fitness activities
- Competitive Compensation: Receive recognition and reward for your expertise and contributions
- Impactful Projects: Engage in work that supports clean energy, sustainable design, and environmental innovation

📌 Electro-Mechanical Design Engineer – Packaging & System Integration (India)
🏢 Mechapixel
📍 India