Responsibilities

- Responsible for Product testing at Wafer and Package level for different type of devices.

- Off load the test from the customer and run production test.

- Strong in Updating the test program/LB/Probe card based on the ECN changes.

- Expert with OSAT process for Product test.

- Yield optimization, lot Deposition with Customer and Fab.

- Single site to Multisite conversions.

- Test Cost reduction, Test time optimization.

- Build a dditional test HW.

- Sound knowledge on Digital, Mixed signal, RF test methodologies.

Experience in developing the test programs in ATE environment for Digital, mixed signal, RF devices.

- Device debug for Digital, Mixed Signal, RF devices using ATE tools and verify with bench Test results.

- Responsible for working with different teams for understanding the device datasheet and come up with a detailed Test procedure/plan to test the chip in ATE environment.

- Robust working experience in Teradyne test systems like ETS(364/88/800), UltraFlex, J750, Magnum,



Advantest V93K systems or any other ATE Tester.

- Knowledge on ATE hardware design (load board probe card), PCB design tools and Signal Integrity analysis.

- Knowledge on Device Characterization, testing at different temperatures.

- Knowledge on data extraction tool like Perl, Python will be added advantage.

Essential Attributes

- Good Knowledge on ATE working on all the tester platforms ( Teradyne , Advantest , Cohu ) , C/C++, VB, Python, Perl.

- Ability in Customer communication and interaction provide status update through e-mails and conference calls.

- Able to initiate and execute projects independently and should be a team player.

Education Qualification: Degree in Engineering ( ECE/EEE) .

Required Experience:

- Candidate should have minimum 10 years' experience in semi-conductor testing in ATE.

- Work experience in OSAT or IDM on the wafer test and Final test products.

📌 Test Product Hardware Engineer (Jagiroad)
🏢 Tata Electronics (TEPL)
📍 Jagiroad