Company: Qualcomm India Private Limited

Job Summary

As a leading technology innovator, Qualcomm pushes the boundaries of what's possible to enable next-generation experiences and drives digital transformation to help create a smarter, connected future for all. As a Qualcomm Hardware Engineer, you will plan, design, optimize, verify, and test electronic systems, bring-up yield, circuits, mechanical systems, Digital/Analog/RF/optical systems, equipment and packaging, test systems, FPGA, and/or DSP systems that launch cutting-edge, world class products.

Qualcomm Hardware

Engineers collaborate with cross-functional teams to develop solutions and meet performance requirements.

Minimum Qualifications

Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 6+ years of Hardware Engineering or related work experience.

OR

Master's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 5+ years of Hardware Engineering or related work experience.

OR

PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 4+ years of Hardware Engineering or related work experience.

Experience: 3+ Years

Location: Bangalore

Job Responsibilities

- Lead end-to-end physical design implementation for large-scale SoCs and complex subsystems, driving projects from architecture definition to successful tapeout.
- Own full-chip and subsystem physical design strategy including Floorplanning, Power Planning (PDN), Placement, CTS, Routing, Timing Closure, Signal Integrity, and Physical Verification.
- Drive PPA (Performance, Power, Area) optimization and signoff closure across advanced process nodes.
- Define and enhance physical design methodologies, automation flows, and best practices to improve design efficiency and quality.
- Lead cross-functional collaboration with Architecture, RTL, STA, DFT, Package, CAD, Technology,



and Product Engineering teams to achieve aggressive silicon schedules.
- Resolve complex design challenges involving timing convergence, congestion, IR/EM, noise, reliability, and manufacturability.
- Provide technical leadership during tapeout planning and execution, ensuring high-quality silicon delivery.
- Mentor and guide junior engineers, driving technical excellence across the organization.
- Influence future design methodologies and contribute to strategic technology roadmap decisions.

Required Skills

- 3+ years of hands-on experience in ASIC/SoC Physical Design with proven success across multiple tapeouts.
- Deep expertise in Floorplanning, Power Delivery Networks, Placement, CTS, Routing, Timing Closure, Signal Integrity, IR/EM Analysis, and Physical Verification.
- Strong understanding of advanced signoff methodologies including STA, SI, Power Integrity, Reliability, DRC/LVS, ERC, PERC, and ESD verification.
- Extensive experience with industry-standard EDA tools such as Innovus, ICC2/Fusion Compiler, PrimeTime, Tempus, Calibre, RedHawk, Voltus, and related signoff tools.
- Proven experience leading physical design execution on advanced technology nodes (5nm, 3nm, or equivalent).
- Solid expertise in low-power design methodologies, power-aware implementation, and multi-voltage designs.
- Demonstrated ability to drive technical decisions, solve complex design challenges, and influence cross-functional teams.
- Excellent leadership, communication, and stakeholder management skills.

Preferred Qualifications

- Experience in high-performance CPU, GPU, AI/ML, Mobile, Networking, Datacenter, or Multimedia SoCs.
- Demonstrated ownership of full-chip physical design and successful delivery of complex SoCs to production.
- Experience driving methodology development, flow automation, and design productivity improvements.
- Prior experience leading and mentoring teams of Physical Design engineers.
- Candidates from leading semiconductor product companies are strongly preferred.

📌 SoC Physical Design Professional (Bengaluru)
🏢 Qualcomm
📍 Bengaluru