Job Summary

We are seeking an IC Package Design Engineer to support the planning, coordination, and execution of IC package design activities across complex semiconductor product development programs.

Role Overview

This role emphasizes program execution, crossfunctional coordination, and delivery predictability, supporting package design efforts from early feasibility and design planning through tapeout and manufacturing readiness. The engineer will collaborate closely with package designers, integration engineers, SI/PI teams, manufacturing partners, and operations teams to ensure alignment, issue tracking, and timely delivery of package milestones.

EDA tools and automation are used primarily as enablers of execution, while the core focus of this role is on driving clarity, managing dependencies, and reducing execution risk.

Minimum Qualifications

- Bachelor's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 2+ years of System/Package Design/Technology Engineering or related work experience.
- Master's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 1+ year of System/Package Design/Technology Engineering or related work experience.
- PhD in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field.

Key Responsibilities Program Execution Coordination (Primary Focus)

- Support execution of IC package design programs from early design planning through tapeout and posttapeout support.
- Develop and maintain execution plans, schedules, task lists, and milestone trackers.
- Track risks, issues, dependencies, and action items across package design, verification, and manufacturing activities.
- Drive action item followup, escalation, and closure with clear ownership and timelines.




- Prepare and deliver status updates, execution summaries, dashboards, and readiness reports for project and engineering stakeholders.
- Support design reviews and execution checkpoints by coordinating inputs, capturing outcomes, and tracking followup actions.
- Use project and program management tools (e.g., dashboards, Gantt charts, milestone trackers, dependency maps) to provide clear visibility into execution status.

CrossFunctional External Engagement

- Coordinate across Package Design, Package Integration, SI/PI, and Operations teams to ensure execution alignment.
- Work closely with Package Process teams to align design assumptions with manufacturing capabilities, process constraints, and yield considerations.
- Interface with New Product Introduction (NPI) teams to support package readiness for qualification, ramp, and highvolume manufacturing.
- Partner with Substrate Engineering Technology teams to track substrate development, availability, risks, and schedule alignment.
- Engage with OSATs and Suppliers to support execution readiness, resolve blocking issues, and ensure manufacturability alignment.
- Coordinate with EDA and tooling teams to ensure design flows and tools are ready to support program needs.

Design, EDA Process Enablement (Supporting / Enabling Role)

- Use existing package design flows, EDA tools, reference methodologies, and execution checklists to support program execution.
- Draft, document,



and maintain process flows that clearly define execution steps, handoffs, inputs, and outputs across the package design lifecycle.
- Develop transparent, structured documentation describing:
- Package design and execution workflows
- Design release and handoff steps
- Readiness checks and acceptance criteria
- Common issues, failure modes, and escalation paths

- Translate complex technical activities into repeatable, welldefined process steps that can be consistently followed across teams.
- Support EDA and designflow issue triage, coordinating with subjectmatter experts and tool owners as needed.
- Apply light scripting or automation where helpful to support reporting, consistency checks, or process enforcement.
- Capture lessons learned and best practices and incorporate them into updated process documentation and workflows.

Required Skills Experience

Program Execution Skills (Core)

- Experience supporting complex, crossfunctional engineering programs.
- Strong organizational skills with the ability to manage multiple workstreams in parallel.
- Experience using project / program management tools, including:
- Execution dashboards
- Milestone and dependency trackers
- Gantt charts or schedule views
- Actionitem and risk tracking tools

- Comfortable driving execution in matrixed organizations without direct reporting authority.
- Strong written and verbal communication skills.

Technical Context (Enabling)

- Familiarity with IC package development lifecycles and execution flows.
- Working knowledge of IC package design, layout, integration, or manufacturing concepts.
- Exposure to package design or EDA tools such as:
- Cadence

Company: Qualcomm India Private Limited Job Area: Engineering Group, Packaging Engineering

📌 Senior Engineer - IC Package Design (Bengaluru)
🏢 Qualcomm
📍 Bengaluru