26 Oct
|
Mirafra Technologies
|
Bengaluru
26 Oct
Mirafra Technologies
Bengaluru
Role: RTL Architect
Experience:
15+ years
Location:
Bangalore/Hybrid
Job Description
• System & Micro-Architecture Definition: Proven ability to translate product requirements and specifications into scalable, power
- and performance-optimized micro-architectures.
• SoC Integration & Sub-System Ownership: Extensive experience in top-level SoC integration, clock/reset architecture, power domain planning, and cross-IP coordination.
• Bus Protocols & Interconnects: Strong expertise in industry-standard protocols such as AXI/AHB/APB, coherent interconnects (ACE/CHI preferred), and peripherals including PCIe, USB, Ethernet, CXL, and DDR.
• CPU & Memory Subsystems: Hands-on experience with CPU subsystem integration (ARM/ARC/RISC-V), cache hierarchy, MMU, and memory controller architectures (DDR, LPDDR).
• Low-Power Architecture: Deep understanding of low-power techniques including UPF/CPF, power gating, clock gating, DVFS, multi-voltage designs, and retention strategies.
• RTL Design & Coding Practices: Strong System Verilog RTL coding skills with emphasis on reuse, configurability, and synthesis-friendly design.
• Verification & Quality Sign-off: Ability to review and guide verification strategy, static checks test plans, functional coverage, assertions, and regression quality metrics.
• Synthesis, STA & Sign-off:
Expertise in synthesis (Design Compiler), static timing analysis, timing closure across multiple PVT corners, and ECO handling.
• Formal & Equivalence Checking: Robust experience with formal verification and logical equivalence checking (LEC).
• DFT & Debug: Good working knowledge of DFT architectures (scan, MBIST, JTAG) and debug/trace infrastructures.
• Post-Silicon Bring-up: Experience with silicon bring-up, lab debugging, silicon validation, and correlation between RTL, simulation, and silicon behaviour.
• Chip IO & Packaging: Understanding of chip IO planning, pad ring integration, signal integrity considerations, and packaging constraints.
• Cross-Functional Leadership: Ability to work closely with PD, DV, DFT, firmware, and software teams to ensure seamless execution and delivery.
• Mentoring & Technical Leadership: Proven capability to mentor engineers, review designs, drive best practices, and own delivery of complex SoC programs.
• Embedded hardware and software co-design: Collaborate with embedded software and firmware teams to ensure hardware and software co-design, enabling efficient SoC architecture. Education
• BTech/ MTech Electrical/Electronics/Computer Science Engineering or Equivalent.
📌 RTL Architect (Bengaluru)
🏢 Mirafra Technologies
📍 Bengaluru