Purpose of the Job:
• This role is responsible for developing cutting-edge, cost-effective packaging solutions for integrated circuits, ensuring optimal performance, reliability, and manufacturability.
• Fully accountable for new product development – design > material selection > qualification > LVM > Offload and process engineer providing end to end technology & process development, covering conventional & advanced packages.
• Able to lead technically the team of experts, to achieve all the deliverables, through flawless execution on the NTI / NPI programs and service the customer timely.

Key Responsibilities
• Able to be hands-on, in designing DOE, Process characterization & optimization, develop manufacturable recipe meeting all the CTQ matrices & yield.
• Strong understanding of semiconductor packaging materials, processes, and failure mechanisms.
• Must be very familiar and hands-on experience on the TD / NPI methodology, covering all the process involved.
• Provide direction, technical leadership and hands-on experience to ensure all different functional dept work in sync to achieve the common dept/org goal.
• Lead, understand, integrate and innovate to meet customers’ packaging requirements into a cost competitive DFM solution.
• To make a characterization plan and risk assessment for new and existing device requiring engineering support.
• Understand systematic problem-solving methodology using qualified tools like ESDA/FMEA/SPC/DOE/MSA etc.
• To drive yield and quality improvement.




• Responsible for guiding NPI & Process SME’s in resolving yield and quality issues.
• Able to define process flows and material sets. Source & characterize material. Develop and execute standard operating procedures (SOPs) and ensure all designs meet quality and industry standards.
• Able to source, characterise & qualify new material required for packaging / technology.
• Customer interface – handling TD / engineer activities / quality performance mtgs / manage issues.
• Work with TPM / Customer for current NPI design win opportunities & technical issues.
• To drive material cost reduction programs, through value engineer program.
• Able to cohesively co-work with all supporting groups & operations team. Essential Attributes:
• All aspects of this job are NTI & Assembly Process Engineering plant wide, affecting operations.
• In depth know-how of DOE/SPC/FMEA/MSA/JMP and other problem-solving methodology tools.
• Proven record in process stabilization, yield improvement and high-volume manufacturing support.

Qualifications:
• Degree in Engineering or its equivalent. Desired Experience Level:
• Minimum 5years of experience in TD Development, Assembly Process Engineering, in a multinational OSAT industry.
• Knowledgeable in package assembly process equipment & manufacturing.
• Knowledge in APQP standards and Automotive standards.
• Experience in leading a group or team of employees in the achievement of organizational goals is mandatory. Added advantage if both start-up and HVM experienced

📌 Process Engineer (Bengaluru)
🏢 Tata Electronics
📍 Bengaluru