Purpose of the Job

- This role is responsible for developing cutting-edge, cost-effective packaging solutions for integrated circuits, ensuring optimal performance, reliability, and manufacturability.
- Fully accountable for recent product development – design > material selection > qualification >
- LVM >
- Offload and process engineer providing end to end technology & process development, covering conventional & advanced packages.
- Able to lead technically the team of experts, to achieve all the deliverables, through flawless execution on the NTI / NPI programs and service the customer timely.

Key Responsibilities:

- Able to be hands-on, in designing DOE, Process characterization & optimization, develop manufacturable recipe meeting all the CTQ matrices & yield.
- Strong understanding of semiconductor packaging materials, processes, and failure mechanisms.
- Must be very familiar and hands-on experience on the TD / NPI methodology, covering all the process involved.
- Provide direction, technical leadership and hands-on experience to ensure all different functional dept work in sync to achieve the common dept/org goal.
- Lead, understand, integrate and innovate to meet customers’ packaging requirements into a cost competitive DFM solution.
- To make a characterization plan and risk assessment for new and existing device requiring engineering support.
- Understand systematic problem-solving methodology using qualified tools like ESDA/FMEA/SPC/DOE/MSA etc.
- To drive yield and quality improvement.
- Responsible for guiding NPI &




- Process SME’s in resolving yield and quality issues.
- Able to define process flows and material sets. Source & characterize material. Develop and execute standard operating procedures (SOPs) and ensure all designs meet quality and industry standards.
- Able to source, characterise & qualify new material required for packaging / technology.
- Customer interface – handling TD / engineer activities / quality performance mtgs / manage issues.
- Work with TPM / Customer for new NPI design win opportunities & technical issues.
- To drive material cost reduction programs, through value engineer program.
- Able to cohesively co-work with all supporting groups & operations team.

Essential Attributes:

- All aspects of this job are NTI &
- Assembly Process Engineering plant wide, affecting operations.
- In depth know-how of DOE/SPC/FMEA/MSA/JMP and other problem-solving methodology tools.
- Proven record in process stabilization, yield improvement and high-volume manufacturing support.

Qualifications:

- Degree in Engineering or its equivalent.

Desired Experience Level:

- Minimum 5years of experience in TD Development, Assembly Process Engineering, in a multinational OSAT industry.
- Knowledgeable in package assembly process equipment & manufacturing.
- Knowledge in APQP standards and Automotive standards.
- Experience in leading a group or team of employees in the achievement of organizational goals is mandatory. Added advantage if both start-up and HVM experienced

📌 Process Engineer (Bengaluru)
🏢 Tata Electronics
📍 Bengaluru