Job Title: PCB Design Engineer

Experience: 4+ Years

Qualification: Diploma / Bachelor’s Degree in ECE, EEE, or EIE

Technical Tool: Cadence Allegro

Job Summary

We are looking for an experienced PCB Design Engineer with strong expertise in multilayer PCB design, high-speed and high-power PCB layouts, DDR memory routing, and HDI technology. The ideal candidate should have hands-on experience in schematic capture, component library development, PCB placement and routing, and manufacturing output generation using Cadence Allegro.

The candidate will collaborate with cross-functional engineering teams to deliver reliable, manufacturable, and high-quality PCB designs that meet electrical, mechanical, and manufacturing requirements.

Key Responsibilities

- Design and develop multilayer PCBs for high-speed, high-power, and mixed-signal applications.
- Perform component placement and PCB routing while adhering to signal integrity (SI), power integrity (PI), and electrical design constraints.
- Design DDR memory interfaces and implement high-speed routing techniques.
- Develop high-power PCB layouts with appropriate considerations for current capacity, thermal management, and power distribution.
- Work on High-Density Interconnect (HDI) PCB designs, including blind vias, buried vias, and microvias.
- Plan PCB stack-ups and implement appropriate routing strategies for multilayer designs.
- Perform schematic capture, component library development, and PCB layout design.
- Conduct design reviews and resolve layout-related issues in coordination with hardware, mechanical, SI/PI, and manufacturing teams.
- Ensure compliance with Design for Manufacturability (DFM), Design for Assembly (DFA), and applicable PCB design standards.
- Generate and release manufacturing deliverables, including Gerber files, fabrication drawings, assembly drawings, and other supporting documentation.
- Coordinate with PCB fabrication and assembly vendors to address manufacturing-related queries and resolve design issues.
- Maintain design documentation,



revision control, and release records throughout the development lifecycle.

Required Qualifications and Technical Skills

- Diploma or Bachelor's degree in Electronics and Communication Engineering (ECE), Electrical and Electronics Engineering (EEE), Electronics and Instrumentation Engineering (EIE), or a related discipline.
- Minimum 4 years of hands-on experience in PCB design and layout engineering.
- Proficiency in Cadence Allegro for PCB layout design and routing.
- Solid experience in the following areas:
- DDR memory PCB layout and high-speed routing.
- High-power PCB design and power distribution.
- HDI PCB design involving blind, buried, and microvias.
- Multilayer PCB stack-up planning and routing techniques.
- Schematic capture and component library development.
- PCB layout design, Gerber generation, and manufacturing release.
- Good understanding of PCB fabrication, assembly processes, and manufacturing constraints.
- Knowledge of DFM, DFA, and PCB layout design best practices.

Preferred Skills

- Understanding of signal integrity (SI) and power integrity (PI) considerations.
- Experience coordinating with PCB fabrication and assembly vendors.
- Ability to interpret mechanical drawings, component placement constraints, and enclosure requirements.
- Familiarity with PCB design documentation, revision management, and engineering change processes.

Soft Skills

- Strong analytical, troubleshooting, and problem-solving abilities.
- Good communication and interpersonal skills.
- Ability to collaborate effectively with cross-functional engineering teams.
- Strong attention to detail and commitment to design quality.
- Ability to manage multiple assignments and meet project deadlines.

Ideal Candidate Profile

The ideal candidate will have hands-on expertise in Cadence Allegro, multilayer PCB layout, DDR routing, high-power PCB design, and HDI technology. The candidate should be comfortable working across the PCB development lifecycle, from schematic capture and layout design to manufacturing documentation and final design release.

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