Design Lead (India)

Design Lead (India)

31 Oct
|
HCLTech
|
India

31 Oct

HCLTech

India

Job Summary

Job Description: Mechanical Engineer – System Design (7–9Years Experience)
Position Summary
The Mechanical Engineer – Core Design plays a key role in the design and development of semiconductor equipment, mechanical modules, sheet-metal structures, precision assemblies, and complex subsystems. The role requires strong expertise in UG NX, GD&T;, Sheet Metal, Tolerance Stack-up, Semiconductor Fabrication Processes, Material Selection, SOM, and FEA (Structural & Thermal). This engineer will lead concept creation, detailed design, validation, and cross-functional collaboration to deliver high-quality mechanical solutions.

Key Responsibilities

Core Mechanical Design: Create detailed 3D models and assemblies using UG NX, develop innovative concepts, apply DFM/DFA principles, and conduct trade-off analysis.

Skill Requirements

GD&T; & Tolerance Engineering: Apply ASME Y14.5 standards, conduct 2D/3D tolerance stack-ups, and validate critical tolerances.

Sheet Metal & Machined Component Design: Design enclosures, brackets, frames, and apply sheet-metal design rules including bend allowances and manufacturability.

Semiconductor Fabrication Process Knowledge: Understand vacuum design, plasma interaction, thermal loads, contamination control, and process module interfaces.

Material Selection & SOM: Select materials based on mechanical, thermal,



chemical, and vacuum criteria; develop SOM documentation and risk analysis.

FEA – Structural & Thermal: Perform structural/thermal analysis, evaluate static/dynamic loads, perform modal studies, and validate heat dissipation.

Cross-Functional Collaboration: Work with electrical, systems, manufacturing, supply chain, and reliability teams; drive design reviews.

Testing, Validation & Release: Support prototype builds, perform functional testing, implement ECOs, and release designs through PLM tools.
2. Required Technical Skills

UG NX (Expert Level)

GD&T; (ASME Y14.5)

Sheet Metal Design and Drafting

Tolerance Stack-up (Worst Case & Statistical)

Semiconductor Fabrication Process Knowledge

Material Selection for Vacuum & Cleanroom Applications
Classification: Internal

Structural & Thermal FEA (ANSYS/Abaqus)

SOM Documentation Knowledge

DFM/DFA Application

PLM Tools (Teamcenter/Windchill)
3. Professional Skills

Solid communication and presentation abilities.

Ability to lead technical discussions and decisions.

Analytical problem-solving and root-cause analysis capability.

Must Have Skill

Equipment Design,NX CAD,Product Design

Good to Have Skill

Other Requirements

📌 Design Lead (India)
🏢 HCLTech
📍 India

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