Strong knowledge in Signal Integrity and Power Integrity fundamental concepts.Solid experience in Package and PCB modelling is required.
Performs Transmission line & Via modelling and carry out experiments to validate modelling outcomes and methodologies.Deep Understanding of S-parameter & its modelling concepts for Single ended and differential interfaces.Experience in simulating (FD/TD) memory interfaces for Board and Package is required (DDR4/LPDDR4)Experience in simulating (FD/TD) High Speed Serial IO interfaces for Board and Package is required (PCIe Gen3/4, SATA Gen3, USB3/3.1 and Display Interfaces etc.)Good knowledge of Power Delivery Network, impedance profile analysis, IR Drop Analysis, and time domain Analysis.Experience in extracting the PDN model of package and PCB power rails and perform decoupling capacitor optimization, Loop inductance analysis.
Key Responsibilities
Should be able to analyze and review the layout files related to Signal integrity and Power Integrity problems.Should be able to provide practical solutions to PCB/Package design team based on simulation results and analysis.Strong knowledge in simulation tools specifically Hspice, Sigrity (2.5D and 3D-EM Must), ADS and other tools like Ansys SIwave, HFSS 3D.
Skill Requirements
PDN mechanismS-parameter and their propertiesPI metrics, namely Rpath (DC R), IR drop, current density, droop, overshoot, load line (impedance profile)VR PI modelingDC, AC and Transient analysis using the tools in #1PDN design optimization and guideline