About the Role
Good hands-on experience in IC Package Substrate design and Interposer Design Familiarity with various package configuration and assembly/substrate technology Good knowledge of substrate structure, design rules Experience in scripting Perl/ SKILL programming Understanding of DRC and DFM (Design For Manufacturing) Understanding in SI/PI tools, package model extraction, S-parameter Experience of Cadence Allegro tools
- Allegro Package Design+/ Allegro SIP Experience of Synopsys 3D IC compiler is added advantage Design experience with MCM/SiP packages, module schematic and layout design experience Knowledge of Complex, High-Speed PCB, and IC Packaging is good to have Qualifications BE/B.
Tech/M.
Tech with 8 to 15 Years experience in IC Packaging Required Skills
• Good hands-on experience in IC Package Substrate design and Interposer Design
• Familiarity with various package configuration and assembly/substrate technology
• Good knowledge of substrate structure, design rules
• Experience in scripting Perl/ SKILL programming
• Understanding of DRC and DFM (Design For Manufacturing)
• Understanding in SI/PI tools, package model extraction, S-parameter
• Experience of Cadence Allegro tools
- Allegro Package Design+/ Allegro SIP
• Design experience with MCM/SiP packages, module schematic and layout design experience
• Knowledge of Complex, High-Speed PCB, and IC Packaging is valuable to have Preferred Skills
• Experience of Synopsys 3D IC compiler is added advantage