Good hands-on experience in IC Package Substrate design and Interposer Design Familiarity with various package configuration and assembly/substrate technology Good knowledge of substrate structure, design rules Experience in scripting Perl/ SKILL programming Understanding of DRC and DFM (Design For Manufacturing) Understanding in SI/PI tools, package model extraction, S-parameter Experience of Cadence Allegro tools - Allegro Package Design+/ Allegro SIP Experience of Synopsys 3D IC compiler is added advantage Design experience with MCM/SiP packages, module schematic and layout design experience Knowledge of Complex, High-Speed PCB, and IC Packaging is good to have
Qualifications
BE/B.Tech/M.Tech with 8 to 15 Years experience in IC Packaging
Required Skills
- Valuable hands-on experience in IC Package Substrate design and Interposer Design
- Familiarity with various package configuration and assembly/substrate technology
- Good knowledge of substrate structure, design rules
- Experience in scripting Perl/ SKILL programming
- Understanding of DRC and DFM (Design For Manufacturing)
- Understanding in SI/PI tools, package model extraction, S-parameter
- Experience of Cadence Allegro tools - Allegro Package Design+/ Allegro SIP
- Design experience with MCM/SiP packages, module schematic and layout design experience
- Knowledge of Complex, High-Speed PCB, and IC Packaging is good to have
Preferred Skills
- Experience of Synopsys 3D IC compiler is added advantage