Job Summary

- IC Package Design Engineer with 3+ years experienced

- Experience with Cadence Advanced Package designer, IC Package Design experience with Cadence APD Layout tool
- Good understanding of package/substrate design and package assembly rules related to flip chip designs.

Key Responsibilities

- Exposure to different package technologies such as MCM, flip chip / wire bond, 3D, 2.5D etc., added advantage
- Expertise in High-Speed Complex Package and PCB designs with HDI, Blind and Buried Via technologies

- Hands-on expertise with PCB designs involving High Speed Parallel Bus interfaces including DDR, LPDDR, GDDR and HSIO interfaces including PCIe, SERDES.
- Valuable Exposure to Stackup design, DFM, DFA rules and adherence.
- Should have expertise in constraint setting in layout tool.

Skill Requirements

IC Package Layout, Flip Chip, FcBGA, MLO design, MLC design, Cadence APD, Cadence Package Designer

Must Have Skill

Package Design

Good to Have Skill

Other Requirements

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📌 Senior Designer (India)
🏢 HCLTech
📍 India