Job Summary

Looking for a motivated Signal Integrity and Power Integrity Engineer with 3-6 years of experience to support high-speed package and PCB design. The candidate will have a strong foundation in SI/PI analysis, modeling, and simulation, along with exposure to package and PCB design. Candidate will work closely with system-hardware and packaging teams to ensure robust high-speed performance and reliable power delivery across products.

Education

- MS/M.Tech in Electronics or equivalent.

Requirements

- 3-6 years of industry experience in Signal Integrity and Power Integrity for package and/or PCB designs.
- Solid understanding of PDN for Chip packaging/substrate and PCB. Hands-on experience with SI/PI tools such as Cadence Sigrity, ADS, Ansys SIwave/HFSS, HyperLynx.
- Ability to analyze S-parameters, impedance profiles, TDR results, and PDN frequency responses.
- Familiarity with package design basics.

Travel Time

0% - 25%

Disclaimer: This job posting has been aggregated from external source. Role details, content, and availability are subject to change. Applicants are advised to confirm the latest information directly on the company website before applying.

📌 Signal Integrity and Power Integrity Engineer (Hyderabad)
🏢 Microchip Technology
📍 Hyderabad