Sandisk understands how people and businesses consume data and we relentlessly innovate to deliver solutions that enable today’s needs and tomorrow’s next big ideas. With a rich history of groundbreaking innovations in Flash and advanced memory technologies, our solutions have become the beating heart of the digital world we’re living in and that we have the power to shape. Sandisk meets people and businesses at the intersection of their aspirations and the moment, enabling them to keep moving and pushing possibility forward. We do this through the balance of our powerhouse manufacturing capabilities and our industry-leading portfolio of products that are recognized globally for innovation, performance and quality. Sandisk has two facilities recognized by the World Economic Forum as part of the Global Lighthouse Network for advanced 4IR innovations. These facilities were also recognized as Sustainability Lighthouses for breakthroughs in efficient operations. With our global reach, we ensure the global supply chain has access to the Flash memory it needs to keep our world moving forward. Description Staff Engineer, Electronic Design Engineering (Signal and Power Integrity) Job Summary We are seeking a highly experienced Staff Engineer, Electronic Design Engineering (Signal and Power Integrity) to provide technical leadership in the design, analysis, optimization, and qualification of high-speed digital systems and power delivery networks. The engineer will drive end-to-end Signal Integrity (SI) and Power Integrity (PI) analysis and signoff across ASIC, package/substrate, PCB, connectors, and system interfaces, working closely with ASIC, packaging, hardware, PCB layout, validation, power, and manufacturing teams. This is a senior technical individual-contributor role requiring deep expertise in Signal and Power Integrity, strong engineering judgment, hands-on simulation and analysis capabilities, and the ability to solve complex cross-domain engineering problems and influence designs across multiple programs.

Key Responsibilities
Signal Integrity
• Define SI requirements, analysis methodologies, design guidelines, and signoff criteria for high-speed interfaces.
• Perform and guide pre-layout and post-layout SI simulations for ASIC, package, and PCB interconnects.
• Analyze insertion loss, return loss, crosstalk, impedance discontinuities, reflections, jitter, eye diagrams, and timing margins.
• Develop, extract, and validate channel models using S-parameters, IBIS, IBIS-AMI, SPICE, and other appropriate electrical models.
• Drive channel optimization including stack-up, routing topology, trace geometry, via design, package breakout, connector transitions, termination, and equalization.
• Perform end-to-end channel analysis for high-speed interfaces such as PCIe, DDR, CXL, NAND/ONFI, and other SerDes or parallel interfaces.
• Develop and analyze SI timing and channel budgets across ASIC, package, PCB, and system components.
• Identify SI margin limitations and recommend design changes to meet interface specifications and system requirements.
• Correlate simulation results with lab measurements, silicon characterization, and system-level performance.



Power Integrity
• Perform and drive Power Delivery Network (PDN) analysis and optimization across die, package, PCB, and system.
• Define target impedance and power-delivery requirements across applicable frequency ranges.
• Perform DC and AC power-integrity analysis including IR drop, impedance, resonance, voltage droop, power-plane behavior, and decoupling optimization.
• Evaluate ASIC, package, and PCB contributions to overall power-delivery performance.
• Develop optimal decoupling strategies across on-die capacitance, package capacitors, PCB capacitors, VRM, planes, vias, and interconnect structures.
• Identify and resolve power-integrity issues including resonances, excessive impedance, voltage noise, and power/ground coupling.
• Perform power-noise analysis and assess its impact on high-speed interfaces, timing, and overall system performance.
• Correlate PI simulation results with laboratory measurements and system characterization. Package and PCB Co-Design
• Drive electrical co-design across die, package/substrate, PCB, connector, and system.
• Optimize package ballout, escape routing, reference structures, layer assignments, power/ground distribution, and high-speed signal routing.
• Evaluate package and PCB stack-ups, materials, copper structures, loss characteristics, and manufacturing constraints.
• Evaluate package and PCB design trade-offs for SI/PI performance, including routing density, layer count, via structures, reference planes, and power delivery.
• Work closely with package, PCB, ASIC, mechanical, thermal, power, validation, and manufacturing teams to resolve cross-domain design trade-offs.
• Identify SI/PI design risks early in the product development cycle and drive appropriate mitigation strategies. SI/PI Methodology and Technical Leadership
• Develop and improve SI/PI simulation, analysis, design-review, and signoff methodologies.
• Define modeling requirements, analysis checklists, design constraints, and simulation-to-measurement correlation strategies.
• Lead root-cause investigations involving SI, PI, timing, jitter, noise, coupling, or power-delivery interactions.
• Drive simulation-to-measurement correlation and continuously improve models and methodologies based on silicon and system results.
• Develop and promote automation of modeling, simulation, post-processing, design-rule checking, and engineering workflows.
• Develop reusable simulation flows and engineering methodologies to improve analysis efficiency, consistency, and quality across multiple programs.
• Provide technical guidance and mentorship to SI/PI engineers.
• Participate in architecture and design reviews and provide quantitative technical recommendations.




• Collaborate across engineering teams to drive technically sound design decisions while balancing performance, power, cost, manufacturability, and schedule. Required Qualifications
• Bachelor's or Master's degree in Electrical Engineering, Electronics Engineering, Computer Engineering, or a related technical discipline.
• 8+ years of industry experience in Signal Integrity, Power Integrity, high-speed digital design, package design, PCB design, or related hardware engineering.
• Strong understanding of transmission-line theory, electromagnetic fundamentals, S-parameters, impedance, termination, reflections, crosstalk, jitter, timing, and high-speed channel behavior.
• Strong knowledge of Power Delivery Networks (PDN), target impedance, IR drop, transient power delivery, resonance, decoupling, and power/ground noise.
• Experience with ASIC, package, and PCB electrical co-design.
• Experience with pre-layout and post-layout SI/PI analysis and design optimization.
• Experience with 2D/3D electromagnetic extraction and circuit/channel simulation.
• Robust understanding of IBIS, IBIS-AMI, SPICE, and S-parameter models.
• Experience analyzing high-speed interfaces such as PCIe, DDR, CXL, NAND/ONFI, SerDes, or comparable technologies.
• Strong understanding of PCB/package stack-ups, material properties, vias, return-current paths, reference planes, power/ground structures, and decoupling strategies.
• Ability to analyze SI/PI issues across multiple design domains rather than treating ASIC, package, and PCB independently.
• Demonstrated ability to independently investigate and solve complex technical problems spanning multiple engineering disciplines.
• Strong written and verbal communication skills with the ability to clearly communicate complex technical concepts and influence engineering decisions. Preferred Qualifications
• Advanced degree in Electrical Engineering, Electronics Engineering, Computer Engineering, or a related field.
• Hands-on experience with industry-standard SI/PI and electromagnetic simulation tools such as Ansys HFSS/SIwave, Cadence Sigrity, Keysight ADS, Synopsys HSPICE, or equivalent tools.
• Experience with laboratory Additional Information Sandisk thrives on the power and potential of diversity. As a global company, we believe the most effective way to embrace the diversity of our customers and communities is to mirror it from within. We believe the fusion of various perspectives results in the best outcomes for our employees, our company, our customers, and the world around us. We are committed to an inclusive environment where every individual can thrive through a sense of belonging, respect and contribution. Sandisk is committed to offering opportunities to applicants with disabilities and ensuring all candidates can successfully navigate our careers website and our hiring process. Please contact us at [email protected] to advise us of your accommodation request. In your email, please include a description of the specific accommodation you are requesting as well as the job title and requisition number of the position for which you are applying.

📌 Staff Electronic Design Engineer (Bengaluru)
🏢 Sandisk
📍 Bengaluru