NPI Mold Process SME (Subject Matter Expert) Position Code: CG_ENG_NPI_111

Location: Sanand, Gujarat

Experience: 10-15+ Years

Industry: Semiconductor Assembly, OSAT & Advanced Packaging

About CG Semi

CG Semi is building a world-class semiconductor assembly, packaging, and test ecosystem in India. As part of our manufacturing and technology expansion, we are seeking an experienced NPI Mold Process SME to provide technical leadership for semiconductor molding processes and support the successful industrialization of new package technologies.

This role offers the opportunity to drive process development, package qualification, equipment readiness, and manufacturing excellence within a rapidly growing semiconductor packaging environment.

About the Role The NPI Mold Process SME will serve as the technical owner for semiconductor molding processes throughout the Recent Product Introduction (NPI) lifecycle, from customer technical alignment and process development through qualification and mass production release.

The role is responsible for mold process characterization, material qualification, tooling readiness, process optimization, APQP execution, yield improvement, and manufacturing transfer activities. The successful candidate will work closely with package design, process engineering, quality, equipment, reliability, suppliers, and customer engineering teams to ensure robust, scalable, and cost-effective manufacturing processes.

This position is critical in ensuring package integrity, process capability, product reliability, and operational readiness for semiconductor package launches.

Key Responsibilities

Mold Process Development & Technical Ownership

- Lead end-to-end ownership of molding processes for NPI programs from engineering build through high-volume production.
- Define, optimize, and validate critical molding parameters including:

- Mold temperature

- Transfer pressure

- Injection speed

- Cure profile

- Clamp force

- Transfer time
- Develop and optimize molding recipes for semiconductor package families including:

- QFN

- DFN

- SOP

- SSOP

- QFP

- BGA

- Advanced package variants
- Establish process windows and operating limits to ensure robust manufacturing performance.
- Drive mold process characterization and qualification activities during:

- Engineering Lots

- Characterization Builds

- Qualification Runs

- Reliability Builds
- Production Ramp-Up

Advanced Package & Process Engineering
- Develop molding solutions for:

- Thin packages
- Large-body packages
- Multi-row QFN/DFN packages
- Exposed-pad packages

- Complex package architectures
- Evaluate package designs and ensure molding process compatibility.
- Collaborate with package design and assembly engineering teams to optimize package manufacturability and reliability.
- Support package development reviews and technical readiness assessments.

APQP & NPI Program Management
- Lead execution of NPI and APQP deliverables including:

- PFMEA

- Control Plans

- Process Validation
- MSA / GR&R;

- Capability Studies

- DOE Activities
- Conduct comprehensive 4M readiness reviews covering:

- Machines

- Mold Chase / Tooling

- Materials

- Methods

- Manpower

- Supporting Equipment
- Ensure manufacturing readiness prior to qualification and production release.
- Support customer technical reviews and qualification approvals.

Mold Material, Equipment & Tooling Management
- Lead evaluation and qualification of molding equipment and associated tooling.
- Support FAT, SAT, and CIQ activities for current molding systems.

- Establish technical requirements for

- Mold chase design

- Gate design

- Runner design

- Cavity layout

- Process specifications
- Evaluate and qualify EMC (Epoxy Molding Compound) materials based on:





- Package architecture

- Moisture Sensitivity Level (MSL)

- Reliability requirements

- Warpage performance

- Flow characteristics

- Customer specifications
- Optimize mold compound utilization, tool life, equipment productivity, and overall manufacturing efficiency.

Defect Reduction & Yield Improvement
- Lead investigations and corrective actions for mold-related defects including:

- Delamination

- Wire Sweep

- Die Shift

- Flash

- Resin Bleed

- Voids

- Incomplete Fill

- Package Cracks

- Chipping

- Mold Compound Contamination
- Apply structured problem-solving methodologies including:
- 8D

- DMAIC

- DOE

- Statistical Analysis
- Improve process capability and reduce package quality excursions.
- Implement SPC-based control strategies to maintain stable manufacturing performance.

Reliability & Quality Engineering
- Support package qualification and reliability programs.
- Partner with Quality, Reliability, and Failure Analysis teams to establish root causes and corrective actions.

- Drive process improvements enhancing

- Yield

- Reliability

- Cycle Time

- Cost

- Equipment Throughput
- Establish sustainable process controls supporting long-term manufacturing stability.

Cross-Functional & Customer Collaboration
- Collaborate with:

- Package Design

- Wire Bond Engineering

- Die Attach Engineering

- Leadframe Engineering

- Substrate Engineering

- Equipment Engineering

- Manufacturing Operations
- Quality & Reliability Teams
- Interface directly with customers for technical discussions, qualification reviews, and closure of molding-related action items.
- Provide technical guidance and mentorship to engineering and manufacturing teams.

Required Experience
- Bachelor's Degree in Mechanical Engineering, Materials Engineering, Chemical Engineering, Manufacturing Engineering, or a related discipline.
- 10-15+ years of semiconductor assembly and molding process engineering experience within OSAT or semiconductor manufacturing environments.

- Proven experience in

- Mold Process Development

- Package Qualification

- Process Characterization

- Tooling Development

- Customer Technical Support
- Strong understanding of semiconductor assembly manufacturing and package qualification methodologies.
- Experience supporting product introduction from development through mass production release.
- Demonstrated success in driving process capability improvements and manufacturing optimization initiatives.

Preferred Experience Candidates with experience in one or more of the following areas will be strongly preferred:
- Semiconductor Assembly & Packaging
- OSAT Manufacturing Operations
- Advanced Packaging Technologies
- QFN / DFN Manufacturing
- QFP Manufacturing
- BGA Manufacturing
- Transfer Molding Processes
- EMC Material Qualification
- Package Reliability Engineering
- High-Volume Manufacturing Environments
- Greenfield Semiconductor Manufacturing Projects
- New Product Introduction (NPI)
- Equipment Commissioning & Qualification
- APQP Deployment

Required Technical Skills

Mold Equipment

Hands-on expertise with:
- TOWA
- ASMPT
- Yamada
- APIC Yamada
- Fico
- Equivalent semiconductor molding platforms

Materials Engineering

Strong understanding of

- Epoxy Mold Compounds (EMC)
- Release Films
- Mold Chase Materials
- Material Qualification Methodologies
- Moisture Sensitivity Requirements




- Warpage Performance Optimization

Tooling & Mold Design

Experience with

- Mold Chase Design
- Gate Design
- Runner Configuration
- Cavity Layout Design
- Package Interface Design
- Process Specification Development

Failure Analysis & Inspection Techniques Hands-on experience with:
- C-SAM Analysis
- X-Ray Inspection
- Cross-Section Analysis
- Warpage Measurement
- Dimensional Analysis
- Defect Characterization

Engineering & Analytical Software

Strong working knowledge of

- AutoCAD
- SolidWorks
- Siemens NX
- Minitab
- JMP
- Statistical Process Control Tools
- MES Systems
- Microsoft Office Suite

Manufacturing & Quality Methodologies

Practical experience in

- APQP
- PFMEA
- Control Plans
- GR&R;
- Capability Studies
- DOE
- SPC
- Process Validation

Preferred Certifications The following certifications are desirable:
- Six Sigma Green Belt
- Six Sigma Black Belt
- ASQ Certified Quality Engineer (CQE)
- ASQ Certified Reliability Engineer (CRE)
- PMP (Project Management Professional)
- Lean Manufacturing Certification

While certifications are advantageous, demonstrated expertise in semiconductor molding process development, qualification, and manufacturing ramp-up will be given greater consideration. Frameworks, Standards & Methodologies

Experience with relevant semiconductor manufacturing and quality frameworks including:

- APQP
- PFMEA
- MSA
- GR&R;
- SPC
- DOE
- DMAIC
- 8D Problem Solving
- Statistical Process Control
- Process Capability Analysis (Cp/Cpk)
- JEDEC Reliability Standards
- Semiconductor NPI Methodologies
- Customer Qualification Frameworks

Candidate Profile We are specifically looking for professionals who can:
- Lead semiconductor mold process development from concept to production.
- Build robust, scalable molding processes for advanced package technologies.
- Balance quality, yield, reliability, throughput, and cost objectives.
- Drive technical problem-solving using structured engineering methodologies.
- Influence cross-functional stakeholders in fast-paced NPI environments.
- Interface confidently with customers, suppliers, equipment vendors, and manufacturing teams.
- Mentor engineers and establish best practices for mold process excellence.
- Lead qualification programs and successful production ramp activities.
- Contribute to the development of a world-class semiconductor manufacturing operation.

Position Details Position: NPI Mold Process SME (Subject Matter Expert)

Position Code: CG_ENG_NPI_111

Location: Sanand, Gujarat

Application Process

Interested candidates can apply through either channel:

Google Form

Apply Now: https://forms.gle/gMtr2FcyYGBoxPZZ8

Email

Email: [email protected]

Email Subject

Application | NPI Mold Process SME | CG_ENG_NPI_111

Candidate Information Required

Please share the following details along with your updated resume:

1. Full Name
2. Current Company
3. Current Designation
4. Current Location
5. Total Experience
6. Relevant Mold Process Engineering Experience
7. Semiconductor / OSAT Experience
8. Experience with QFN, DFN, SOP, SSOP, QFP and BGA Packages
9. Experience in Mold Process Development & Characterization
10. Experience with TOWA, ASMPT, Yamada, Fico or Equivalent Equipment
11. EMC Material Qualification Experience
12. Experience in Tooling / Mold Chase Development
13. APQP, PFMEA, Control Plan and GR&R; Experience
14. Experience Conducting DOE and Capability Studies
15. Experience Supporting NPI, Qualification and Production Ramp Programs
16. Experience in Customer-Facing Technical Reviews
17. Highest Qualification
18. Professional Certifications
19. Current Fixed CTC
20. Variable / Bonus
21. Expected Fixed CTC
22. Notice Period / Earliest Joining Date
23. Current Offers, if any
24. Willingness to Relocate to Sanand, Gujarat (Yes/No)

📌 NPI Mold Process SME (Subject Matter Expert) (Ahmedabad)
🏢 CG Semi
📍 Ahmedabad