Engineering Packaging Lead (Bengaluru)

Engineering Packaging Lead (Bengaluru)

11 Nov
|
Qualcomm
|
Bengaluru

11 Nov

Qualcomm

Bengaluru

Qualcomm India Private Limited
Engineering Group, Engineering Group Hardware Engineering
As a leading technology innovator, Qualcomm pushes the boundaries of what's possible to enable next-generation experiences and drives digital transformation to help create a smarter, connected future for all. As a Qualcomm Hardware Engineer, you will plan, design, optimize, verify, and test electronic systems, bring-up yield, circuits, mechanical systems, Digital/Analog/RF/optical systems, equipment and packaging, test systems, FPGA, and/or DSP systems that launch cutting-edge, world class products. Qualcomm Hardware Engineers collaborate with cross-functional teams to develop solutions and meet performance requirements.
Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 2+ years of Hardware Engineering or related work experience.

Master's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 1+ year of Hardware Engineering or related work experience.
PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field.
Timing analysis, validation and debug across multiple PVT conditions using PT/Tempus.
Good Technical writing and Communication skills, should be willing to work in cross-collaborative setting
Experience in design automation using TCL/Perl/Python.
Familiar with digital flow design implementation RTL to GDS : ICC, Innovous , PT/Tempus
Education : B.Tech or MTech/MS in Electrical/Electronics/Microelectronics/VLSI.




5+ years of experience in STA/Timing

- Strong expertise in STA timing analysis basics, AOCV/POCV concepts, CTS, defining and managing timing constraints, Latch transparency handling, 0-cycle, multi-cycle path handling
- Hands-on experience with STA tools - Prime-time, Tempus
- Have experience in driving timing convergence at Chip-level and Hard-Macro level
- Knowledge of ASIC back-end design flows and methods and tools (ICC2, Innovus)
- Proficient is scripting languages – TCL, Perl, Awk
- If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail [HIDDEN TEXT] or call Qualcomm's toll-free number found here. Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. (Keep in mind that this email address is used to provide reasonable accommodations for individuals with disabilities. Qualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of Company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law.

If you would like more information about this role, please contact Qualcomm Careers.

📌 Engineering Packaging Lead (Bengaluru)
🏢 Qualcomm
📍 Bengaluru

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