Job Description

Hardware Design Engineer – LV/HV Power Electronics & Inverters

Role Summary

Responsible for the end-to-end design and development of low-voltage and high-voltage power electronics hardware, including DC/DC converters and low-power inverter systems, covering analog/digital circuitry, simulations, PCB design support, testing, and compliance with automotive standards.

Key Responsibilities

- Design analog and digital circuits using microcontrollers, op-amps, transistor families, and mixed-signal interfaces.
- Develop low-voltage DC/DC converters and high-voltage wide-input flyback converters (multiple outputs, isolation, transformer design, feedback).
- Design B6 bridge HV inverter (1200V) using SiC MOSFETs, gate drivers, HV filter protection, thermal design, PCB stack-up and insulation.
- Perform worst-case design calculations, derating, stress and power-loss analysis.
- Conduct PSpice/LTspice simulations (time-domain, frequency-domain, Monte Carlo).
- Create schematics in Zuken CR8000/OrCAD and support PCB layout (Allegro/PADS) with considerations for EMC, PCB stack-up, PCB track characteristics, and manufacturability.
- Capture/analyze customer requirements using IBM DOORS NG and follow ASPICE processes.
- Support hardware testing, debugging (Design of experiments), and validation.
- Ensure compliance with ISO 16750, ISO 7637, CISPR 25, ISO 11452, and reinforced insulation standards (12V/24V/400-800V).

Required Skills





- Analog & mixed‑signal circuit design using MCUs, op‑amps, BJTs/MOSFETs, ADC/DAC interfaces, and standard communication interfaces (SPI, I²C, UART, CAN).
- Power electronics design experience with low‑voltage DC/DC converters and wide‑input isolated flyback converters, including magnetics, feedback, and multi‑output regulation.
- High‑voltage inverter design expertise (up to 1200 V) with SiC MOSFETs, isolated gate drivers, protection concepts, thermal design, and reinforced insulation.
- Robust analytical capability in worst‑case design, derating, stress analysis, and power‑loss/thermal calculations.
- Proficiency in circuit simulation using PSpice/LTspice for transient, AC (loop stability), and Monte‑Carlo/worst‑case analysis.
- Schematic design and PCB layout support using Zuken CR8000/OrCAD and Allegro/PADS, with focus on EMC, high‑voltage spacing, stack‑up, and manufacturability.
- Requirements engineering experience using IBM DOORS NG with adherence to ASPICE development and change‑management processes.
- Hands‑on hardware debugging and validation skills, including structured root cause analysis (DoE) and lab‑based troubleshooting.
- Knowledge of automotive standards and compliance, including ISO 16750, ISO 7637, CISPR 25, ISO 11452, and insulation requirements for 12 V/24 V/400–800 V systems.

Qualifications

Electronics (BE/ME)

Additional Information

> 6yrs

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