STAFF R&D/PRODUCT DVL ENGINEER (Bengaluru)

STAFF R&D/PRODUCT DVL ENGINEER (Bengaluru)

11 Nov
|
TE Connectivity
|
Bengaluru

11 Nov

TE Connectivity

Bengaluru

This job is with TE Connectivity, an inclusive employer and a member of myGwork – the largest global platform for the LGBTQ+ business community. Please do not contact the recruiter directly.

At TE, you will unleash your potential working with people from diverse backgrounds and industries to create a safer, sustainable and more connected world.

Job Overview

TE Connectivity's Digital Data Networks organization is seeking an experienced Staff R&D;/Product Development Engineer to lead the development of next-generation high-speed I/O connectors and cage assemblies for AI servers, networking equipment, high-performance computing, and hyperscale data centers. The role drives product development from customer requirements and concept creation through detailed design, simulation, prototyping, qualification, industrialization, and production release. The engineer will collaborate with customers, Product Management, Signal Integrity, Thermal Engineering, Manufacturing, Quality, suppliers, and global engineering teams to develop solutions for OSFP/OSFP XD, QDD/QSFP, SFP/SFPDD and future 224G/448G interconnect platforms.

Responsibilities:

• Lead end-to-end development of high-speed connectors, cage assemblies, and cooling solutions from concept through production release.

• Translate customer VOC and mechanical, signal integrity, thermal, and manufacturing requirements into robust product architectures and specifications.

• Design and optimize HSIO connectors, contact systems, housings, grounding structures, cages, EMI shielding, latching and retention mechanisms, alignment features, and module interfaces.

• Develop thermal solutions including heat sinks, thermal bridges, thermal interface solutions and cold plates.





• Create 3D models, 2D drawings, bills of materials, product specifications, and engineering documentation using Creo or equivalent CAD tools.

• Perform GD&T;, tolerance stack-up, DFMEA, mechanical and thermal analysis, design reviews, product validation, and qualification.

• Collaborate with Signal Integrity and Thermal Engineering teams to optimize electrical, mechanical, EMI/EMC, airflow, and thermal performance.

• Drive DFM/DFA, tooling, prototyping, process validation, qualification and certifications activities.

• Apply knowledge of stamping, molding, machining, plating, welding, brazing, and automated assembly to develop scalable and cost-effective products.

• Support customer design discussions, technical proposals, engineering evaluations, troubleshooting, root-cause investigations, and product application issues.

• Execute projects through the LEANPD stage-gate process, maintaining performance, quality, cost, and schedule commitments.

Candidate Desired Profile:

EDUCATION & EXPERIENCE

• Bachelor's degree or higher in Mechanical, Electrical or a related engineering discipline. Master's degree preferred.

• 10+ years of relevant product development or R&D; experience in connectors, electromechanical products, cage systems, thermal management, liquid cooling, or related products.





• Proven experience taking products from customer requirements and concept development through validation, qualification, manufacturing launch, and lifecycle management.

• Experience working directly with global customers and cross-functional engineering, manufacturing, quality, and supplier teams.

REQUIRED SKILLS

• Strong mechanical product design and development fundamentals, including product architecture, material selection, contact mechanics, reliability, and design optimization.

• Advanced proficiency in Creo or an equivalent 3D CAD tool, with strong knowledge of GD&T;, tolerance analysis, DFMEA, DFM/DFA, and product qualification.

• Basic Experience with manufacturing processes such as precision stamping, sheet-metal forming, injection or insert molding, machining, plating, welding or brazing, tooling, and automated assembly.

• Knowledge of high-speed I/O platforms such as OSFP, OSFP-XD, QSFP-DD, and QSFP112, with working knowledge of impedance, insertion loss, return loss, and crosstalk fundamentals.

• Understanding of thermal management technologies including heat sinks, thermal interfaces, airflow, cold plates, manifolds, quick disconnect couplings, and liquid-cooling systems.

• Solid analytical, structured problem-solving, root-cause investigation, customer engagement, presentation, and technical communication skills.

• Ability to provide technical leadership, mentor engineers, and influence global cross-functional teams without direct authority.

PREFERRED SKILLS

- Experience with 224G/448G next-generation interconnect technologies and integrated connector-cage-cooling system developm

📌 STAFF R&D/PRODUCT DVL ENGINEER (Bengaluru)
🏢 TE Connectivity
📍 Bengaluru

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