- Expertise in high-NA DUV imaging/SEM and electron-matter interaction with hands-on semiconductor fabrication experience
- Maximize defect metrology product performance, collaborate with chip manufacturers, contribute to product roadmap and validation
This position is within the process diagnostics and control (PDC) group, which deals with advanced imaging together with cutting edge image processing algorithms in order to detect, measure and classify nanometer size defects from semiconductor fabrication process steps. Application engineers are supposed to maximize the performance of our new defect metrology products through a deep and thorough understanding of use-cases in close technical collaboration with leading-edge chip manufacturing customers.
At a higher expertise level, they also contribute to product development roadmap through spec definition and performance validation.
Desired capabilities:
- Sound fundamentals of high-NA DUV imaging/SEM and light-matter/electron-matter interaction.
- Open to 70% travel to leading semiconductor chip manufacturing fabs overseas
- Lab/fab hands-on experience in semiconductor fabrication with layer-wise detailed knowledge of material, process tech and defectivity
- Detail oriented with strong analytical, problem solving and communication skills.
- Ability to work in a team, and ability to work independently
Functional Knowledge Demonstrates expanded conceptual knowledge in own discipline and broadens capabilities
Business Expertise
Understands key business drivers; uses this understanding to accomplish own work
Leadership
No supervisory responsibilities but provides informal guidance to recent team members
Problem Solving
Solves problems in straightforward situations; analyzes possible solutions using technical experience and judgment and precedents
Impact
Impacts quality of own work and the work of others on the team; works within guidelines and policies
Interpersonal Skills
Explains complex information to others in straightforward situations