Why join Upscale, Inc.

Upscale, Inc., is building the high-performance infrastructure powering the next generation of artificial intelligence. Backed by over $500M in funding and rapid global adoption, we are scaling systems designed for the world’s most demanding AI workloads.

We focus on first-principles engineering across silicon, systems, and networking—where performance, scale, and execution are critical. Our team is talent-dense and high-performing. We value ownership, technical rigor, and speed, and we offer the chance to work on foundational problems with immediate, real-world impact.

If you’re looking to do high-impact work, move fast, and help define the infrastructure behind the future of AI—Upscale is where you can produce meaningful work at the frontier—and operate at a high standard.

Role Summary:
As a Principal Engineer – Physical Design, you will be responsible for leading the implementation of complex, high-performance ASIC/SoC blocks from RTL to GDSII. You will drive design execution, define physical implementation strategies, and mentor engineers to achieve best-in-class Power, Performance, and Area (PPA) across advanced technology nodes.

Key Responsibilities:

- Own end-to-end physical design implementation for large hierarchical blocks, from floorplanning to GDSII signoff.
- Develop and optimize flows for placement, clock tree synthesis (CTS), routing, and timing closure.
- Analyze and optimize IR drop, EM, congestion, and power to meet stringent chip targets.
- Collaborate with RTL, DFT, STA, and power teams to resolve cross-domain issues and ensure robust closure.
- Define and maintain best practices, scripts, and automation flows (Tcl, Python, or Make-based).
- Lead timing,



physical verification (DRC/LVS), and ECO closure at the block and top level.
- Provide technical leadership for floorplan architecture, partitioning, and clock distribution strategies.
- Drive design convergence on multi-corner multi-mode (MCMM) analysis and ensure signoff consistency.
- Partner with CAD and Foundry teams for technology evaluation, library bring-up, and methodology improvement.
- Mentor and guide junior engineers, fostering a strong technical culture within the PD organization.

Required Skills & Experience:

- 10–15+ years of experience in deep-submicron physical design for complex SoCs or ASICs.
- Proven expertise in Cadence Innovus PNR tool.
- Strong understanding of STA (PrimeTime), IR/EM (Voltus), and DRC/LVS (Calibre) flows.
- Solid grasp of RC extraction, clock mesh/tree design, power intent , and hierarchical design methodologies.
- Experience in advanced process nodes (5 nm / 3 nm / N3E/N3P) with exposure to foundry signoff flows.
- Excellent analytical, problem-solving, and debugging skills with attention to detail.
- Proficiency in Tcl, Perl, or Python scripting for automation and flow development.
- Strong communication and leadership skills to coordinate across global cross-functional teams.

Preferred Skills:

- Experience with full-chip integration, floorplan architecture, and package interaction.
- Familiarity with machine learning or AI-based flow optimization is a plus.
- Masters Degree in Electrical / Electronics / VLSI Engineering preferred.

Key Traits for Success:

- Strategic thinker with deep technical insight.
- Collaborative mindset and mentoring spirit.
- Passion for continuous learning and process excellence.
- Ability to balance innovation with execution discipline.

📌 Principal Engineer - Physical Design (Bengaluru)
🏢 Upscale AI
📍 Bengaluru