Die Attach Equipment Technician

Experience: 5 to Not Available years

Location: Kuala Lumpur

Skills: Die Attach equipment, Datacon 8800 FC QUANTUM, Hanwha Die Attach equipment, semiconductor assembly equipment, troubleshooting, Front and Back End assembly equipment, applied statistics, production environment, process handling knowledge, NXP Total Quality Mindset, Safety Awareness, communication skills, problem solving skills

Experience
Die Attach Equipment Technician capable to work independently to maintain and repair Die Attach integrated line which include loader, unloader, die attach, AOI and reflow oven equipment. Die Attach Equipment Technician must have experience working in semiconductor assembly equipment, strong troubleshooting skill and equipment knowledge to ensure all equipment performance always in tip-top condition to meet department OEE and MTBA/MTBF goals.

Responsibilities:
• Die Attach Equipment Technician specialist and vast experience working on Die Attach equipment such as Datacon 8800 FC QUANTUM is a must and preferable also have experience on Hanwha Die Attach equipments.
• Maintain and repair Die Attach integrated line which include loader, unloader, die attach, AOI and reflow oven equipment.
• Perform equipment setup or conversion for any product changes for Die Attach integrated line which include loader, unloader, die attach, AOI and reflow oven equipment.
• To able to work independently to identify, sustain, purchase,



find second source for Die Attach integrated critical spare and tooling.
• To maintain/sustain equipment performance to meet define goal.
• Improve FC Overall OEE, MTBA/MTBF, PM Effectiveness and Unscheduled Downtime.
• To maintain the machine performance, address the problem root cause and solve quality issue cause by the machine.

Compensation Details
• Support production to meet weekly schedule targets through working either normal or shift hours when or where needed. This especially true weekends and public holidays.
• Manage the maintenance activities of machines and fabrication of spare parts.
• Valuable discipline and tardiness with minimum supervise.

Requirements:
• Diploma in Electrical & Electronics or Mechanical and Engineering discipline, or certificate with min 5 years’ of relevant working experience in Die Attach equipment.
• Experience in semiconductor assembly and applied statistics will be an advantage.
• Have good technical skills on Front and Back End assembly equipment.
• Strong interpersonal and communication skills.
• Good decision making / problem solving skills.
• Familiar with production environment & possesses process handling knowledge. (Semiconductor).
• Must be discipline and willing to work long hours and shifts.
• Must adhere NXP Total Quality Mindset and Safety Awareness.
• Must adhere NXP core value Trust and Respect, Collaboration, Ownership, Expertise, Innovation and Growth.
• #LI-DNI

📌 Die Attach Equipment Technician (Mumbai)
🏢 NXP Semiconductors
📍 Mumbai