Quantum Assembly Engineer

Experience: 10 to Not Available years

Location: Essex Junction, Vermont, United States

Skills: cryogenic assembly processes, superconducting assembly processes, 2D quantum packaging, 2.5D quantum packaging, 3D quantum packaging, Flip-chip, micro-bump, superconducting bump attach, Die-to-wafer (D2W), wafer-to-wafer (W2W), hybrid bonding, low-loss superconducting signal paths, mechanical integrity, assembly integration flows, bump/interconnect teams, TSV/interposer integration, substrate/package assembly, traveler flows, prototype builds, assembly yield, failure analysis, root-cause investigations, cryogenic reliability, electrical integrity, RF/microwave integrity, hardware bring-up, validation, debug in cryogenic environments, assembly materials, indium, superconducting metals, underfills, substrates, high-precision alignment, bonding tools, cryogenic-compatible materials handling, quantum device teams, packaging engineers, cryogenic system teams, OSATs, assembly partners, next-generation assembly architectures, high-density interconnect co-packaging, interposer-based integration, 3D stacked integration, assembly process flows, integration guidelines, data analysis

About GlobalFoundries
GlobalFoundries is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world’s most inspired technology companies. With a global manufacturing footprint spanning three continents, GlobalFoundries makes possible the technologies and systems that transform industries and give customers the power to shape their markets. For more information, visit www.gf.com .

Job Summary
GlobalFoundries Fab9 is seeking a highly skilled and motivated R&D; assembly engineer to become part of our Quantum Advanced Packaging team. This role will entail driving next-generation assembly scaling development efforts in our Advanced Packaging and Photonics Center (APPC) as well as with our partners. The primary responsibility of this position is to own development and integration of cryogenic, superconducting assembly processes enabling scalable quantum hardware packaging.

Essential Responsibilities
Lead development of cryogenic-compatible assembly processes for 2D, 2.5D, and 3D quantum packaging platforms.
Define assembly schemes for:
• Flip-chip / micro-bump / superconducting bump attach
• Die-to-wafer (D2W), wafer-to-wafer (W2W), and hybrid bonding
Ensure processes are optimized for low-loss, superconducting signal paths and mechanical integrity at cryogenic temperatures.
Own assembly integration flows from incoming wafer/die through package build.
Coordinate process interactions across:
• Bump/interconnect teams
• TSV/interposer integration
• Substrate/package assembly
Define and maintain process flow specifications, traveler flows, and assembly integration schemes.
Enable prototype builds, ensuring smooth execution through internal and external assembly lines.




Drive assembly readiness for new technologies, including tooling, materials, and process modules.
Support hands-on build/debug during early development phases.
Develop and implement strategies to:
• Improve assembly yield and throughput
• Reduce defects (alignment, voiding, delamination, interconnect failures)
Lead failure analysis and root-cause investigations for assembly-related issues.
Work with test and systems teams to ensure assembled hardware meets:
• Cryogenic reliability across thermal cycles
• Electrical and RF/microwave integrity requirements
Support hardware bring-up, validation, and debug in cryogenic environments (e.g., dilution refrigerators).
Evaluate and select assembly materials and interfaces (e.g., indium, superconducting metals, underfills, substrates) for cryogenic operation.
Work with equipment teams to define requirements for:
• High-precision alignment / bonding tools
• Cryogenic-compatible materials handling
Develop deep understanding of tool capability vs. quantum packaging requirements.
Collaborate with:
• Quantum device / qubit teams
• Packaging & integration engineers
• Cryogenic system and hardware teams
Interface with OSATs, assembly partners, and suppliers to co-develop and scale assembly processes.
Drive development of next-generation assembly architectures for scaling qubit systems:
• High-density interconnect co-packaging
• Interposer-based and 3D stacked integration
Contribute to APPC / Quantum packaging roadmap and capability build-out.
Generate and maintain:
• Assembly process flows
• Specifications and integration guidelines
Provide clear technical updates, data analysis, and reports to stakeholders.
Support IP generation, publications, and conference contributions.

Other Responsibilities
Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs.
Take part in hiring of other Advanced Packaging team members.
Mentor and guide new hires to assume their roles and responsibilities.
Other duties as assigned by manager.

Required Qualifications
Education – Master’s in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science or related field from an accredited degree program. MS degree with at least 10 years of prior related work experience. In depth knowledge of BEOL processes and integration, bump/wafer finish integration, wafer test/probe, OSAT collaboration, and package development & assembly.



Strong problem solving and technical trouble shooting skills including expertise in design of experiment. Must have at least an overall 3.0 GPA and proven positive academic standing.
Language Fluency - English (Written & Verbal).
Travel - Up to 10%.

Preferred Qualifications
Education – PhD education level preferred with at least 8 years of prior related work experience. Demonstrated prior leadership experience in the workplace, school projects, competitions, etc. Project management skills, i.e. the ability to innovate and execute on solutions that matter; the ability to navigate ambiguity. Strong written and verbal communication skills. Strong planning & organizational skills.

Additional Information
GlobalFoundries is an equal opportunity employer, cultivating a diverse and inclusive workforce. We believe having a multicultural workplace enhances productivity, efficiency and innovation whilst our employees feel truly respected, valued and heard. As an affirmative employer, all qualified applicants are considered for employment regardless of age, ethnicity, marital status, citizenship, race, religion, political affiliation, gender, sexual orientation and medical and/or physical abilities. All offers of employment with GlobalFoundries are conditioned upon the successful completion of background checks, medical screenings as applicable and subject to the respective local laws and regulations.
Expected Salary Range $118,000.00 - $210,000.00 The exact Salary will be determined based on qualifications, experience and location. If you need a reasonable accommodation for any part of the employment process, please contact us by email at [email protected] and let us know the nature of your request and your contact information. Requests for accommodation will be considered on a case-by-case basis. Please note that only inquiries concerning a request for reasonable accommodation will be responded to from this email address. An offer with GlobalFoundries is conditioned upon the successful completion of pre-employment conditions, as applicable, and subject to applicable laws and regulations. GlobalFoundries is fully committed to equal opportunity in the workplace and believes that cultural diversity within the company enhances its business potential. GlobalFoundries goal of excellence in business necessitates the attraction and retention of highly qualified people. Artificial barriers and stereotypic biases detract from this objective and may be illegally discriminatory. All policies and processes which pertain to employees including recruitment, selection, training, utilization, promotion, compensation, benefits, extracurricular programs, and termination are created and implemented without regard to age, ethnicity, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, sexual orientation, gender identity or expression, veteran status, or any other characteristic or category specified by local, state or federal law

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