Wire Bond Shift Assistant Engineer (Mumbai)

Wire Bond Shift Assistant Engineer (Mumbai)

05 Aug
|
NXP Semiconductors
|
Mumbai

05 Aug

NXP Semiconductors

Mumbai

Wire Bond Shift Assistant Engineer

Experience: Not Available to Not Available years

Location: Kaohsiung

Skills: (extract from description if available)

Duties and Responsibilities
設備維修 根據生產線異常狀況進行設備故障排除與修復,確保運作順暢。 執行設備問題的初步診斷並完成必要的修理工作。

設備保養
依照保養計劃執行定期預防性維護,以降低設備故障率。 檢查設備運作狀況,記錄維護結果,並提出改善建議。

異常回報與文件紀錄
在系統中準確記錄維修與保養過程,確保資料完整性。 對重大異常立即向工程師或主管回報,並協助後續處理。

安全與品質保證
遵守廠區安全規範,確保維護作業安全。 維修後確保設備符合品質標準,避免影響產品良率。

輪班支援
依生產需求進行輪班工作,確保設備隨時可用。 協助其他部門處理設備相關問題,維持生產效率。

#LI-DNI

📌 Wire Bond Shift Assistant Engineer (Mumbai)
🏢 NXP Semiconductors
📍 Mumbai

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