Role & responsibilities
Developing PCB layout using Cadence Allegro/OrCAD
Schematics, Board layout & routing Execute mixedsignal, highpower & multilayer designs including HDI and rigidflex boards.
Heatsinks & busbars Integrate thermal management hardware into PCB designs.
EMI/EMC – Apply grounding, shielding, and filtering techniques to meet compliance.
Layout for complex ICs - BGAs, QFNs, CSPs, and custom packages.
Thermal, SI & PI analysis – Validate heat dissipation, signal integrity, and power integrity.
Develop and maintain footprints, symbols, and package libraries.
Ensure compliance with MIL, IPC standards, DFM/DFA.
Collaborate with mechanical teams for enclosure compatibility.

Preferred candidate profile




Robust electronics fundamentals – solid understanding of circuits, grounding, and signal flow.
Hands on expertise with Cadence Allegro/OrCAD/ HyperLynx.
Experience in multi-layer, mixed signal, high power, and high-speed PCB design – including HDI and rigid flex.
Knowledge of EMI/EMC, SI & PI analysis.
Background in power electronics layouts – MOSFETs, busbars, decoupling strategies.
Familiarity with IPC standards and DFM/DFA practices.
Collaboration skills – ability to work with hardware, mechanical, and manufacturing teams.

📌 Pcb Design Engineer Hyderabad (India)
🏢 AviationSpace
📍 India