10 Aug
|
Mindgrove Technologies
|
Chennai
10 Aug
Mindgrove Technologies
Chennai
Job Title: IC Packaging Engineer
Job Overview
We are seeking a highly skilled and motivated IC Packaging Engineer to join our Advanced Packaging and Hardware Development team. In this role, you will be responsible for the design, development, simulation, and qualification of next-generation semiconductor packaging technologies. You will bridge the gap between silicon design and physical manufacturing, ensuring our integrated circuits (ICs) meet rigorous performance, reliability, and cost standards.
Key Responsibilities
1. Package Design & Development
Lead the conceptualization, architecture, and detailed design of semiconductor packages (e.g., BGA, QFN/QFP, WLCSP, SiP, 2.5D/3D IC, and Chiplets).
Generate package substrate layouts, ball maps,bond diagram and ball assignments while optimizing for signal integrity, power integrity, and thermal performance.
Collaborate with silicon design teams to define bump/pad configurations and co-optimize the Die-Package-Board interface.
Hand on experience in designing high speed signal layout.
2. Modeling & Simulation
Perform thermal, mechanical,
and thermo-mechanical stress simulations (using FEA tools like ANSYS, Abaqus, or Icepak) to predict package warpage, reliability risks, and thermal dissipation.
Conduct electrical simulations to assess parasitic resistance, inductance, and capacitance (RLC$) metrics.
3. Vendor & OSAT Management
Partner with Outsource Semiconductor Assembly and Test (OSAT) vendors and substrate suppliers to drive current package prototyping and mass production.
Evaluate vendor capabilities, review technical specifications, and resolve manufacturing yield issues.
Requirements
Required Qualifications & Skills
Education & Experience
Education: Bachelor’s, Master’s, in Materials Science, Mechanical Engineering, Electrical Engineering, Microelectronics, or a related field.
Experience: 2+ years of hands-on experience in semiconductor packaging design or manufacturing
Technical Skills
Design Tools: Proficiency i
📌 IC Packaging Engineer (Chennai)
🏢 Mindgrove Technologies
📍 Chennai