Jr. Package Design Engineer (Hyderabad)

Jr. Package Design Engineer (Hyderabad)

18 Aug
|
ASIP Technologies
|
Hyderabad

18 Aug

ASIP Technologies

Hyderabad

Qualification Requirements

- Master’s in VLSI Design (Bachelors with robust track-record considered as well)
- 3-5 yrs industry experience is preferrable
- Ability to travel to USA/Asia
- Strong communication skills
- Ability to work under pressure

Responsibilities

- Closely work with customers to understand the Packaging requirements and propose necessary Design feedback
- Help customers implement Design updates to achieve a high quality Packaging solution
- Work responsibilities include, but not limited to:
- IC Package design & configurations
- Assembly, Substrate Technology
- SI/PI concepts
- Package Model extraction
- High-speed interfaces incl. DDR, PCIe, etc.
- Package/Layout DRCs and Design for Manufacturing
- Package Cost Analysis & Optimization

EDA Tools (Cadence Allegro, Siemens Xpedition, etc.)

Job Category: Engineering

Job Type: Full Time

Job Location: Hyderabad

Qualification Requirements





- Master’s in VLSI Design (Bachelors with strong track-record considered as well)
- 3-5 yrs industry experience is preferrable
- Ability to travel to USA/Asia
- Strong communication skills
- Ability to work under pressure

Responsibilities

- Closely work with customers to understand the Packaging requirements and propose necessary Design feedback
- Help customers implement Design updates to achieve a high quality Packaging solution
- Work responsibilities include, but not limited to:
- IC Package design & configurations
- Assembly, Substrate Technology
- SI/PI concepts
- Package Model extraction
- High-speed interfaces incl. DDR, PCIe, etc.
- Package/Layout DRCs and Design for Manufacturing
- Package Cost Analysis & Optimization

EDA Tools (Cadence Allegro, Siemens Xpedition, etc.)

📌 Jr. Package Design Engineer (Hyderabad)
🏢 ASIP Technologies
📍 Hyderabad

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