About KLVIN

KLVIN Technology Labs is an Industrial AI Platform company. We build edge hardware that generates the data Indian manufacturing has never had, and the SENTINEL Intelligence Platform that turns it into decisions.

Our devices have been commercially deployed since February 2026 across steel, glass, packaging, food and pharma customers. We hold an Indian patent on our predictive maintenance system, and are supported by MeitY under TIDE 2.0 (administered via iCreate), DST under NIDHI Prayas, IIT Hyderabad TBI, ISB DLabs, NSRCEL at IIM Bangalore, the BharatNext accelerator, MathWorks and Peachscore.

Hardware at KLVIN is an R&D; function. We design here; volume assembly runs through an established contract manufacturing partner. That means this role is design-and-validation heavy rather than production-line heavy — but you own the design through to a manufacturable, certifiable, field-proven unit.

The role

We have a working product line, paying customers, a manufacturing partner and a platform team consuming the data. This role is about what comes next: the next generation of our devices, new device types as we expand the family, and raising the engineering bar on everything we ship.

You will set hardware architecture and design the boards yourself. You'll work alongside our hardware engineering team, our platform engineer who owns SENTINEL end-to-end, and our assembly and component vendors, reporting directly to the founder.

To be clear about the shape of it: this is a hands-on lead role, not a management seat. You'll be at the bench and on the factory floor. The leadership is in the architecture calls, the design standards, and mentoring the engineers around you — not in headcount.

On platform choice — ESP32 has been our workhorse and remains a strong answer for connected sensing nodes. As the product family widens, other problems will point elsewhere: ultra-low-power BLE nodes, precision analog acquisition, higher-throughput edge inference, safety-adjacent applications. We want someone who can make and defend that call on the merits, and who is equally comfortable deciding not to switch.

What you'll do

Architect

- Own hardware architecture across the product family — MCU and platform selection, sensing strategy, connectivity strategy, power topology
- Evaluate silicon on technical and commercial merit: performance, power, peripherals, toolchain maturity, ecosystem, lifecycle and availability
- Shape the hardware roadmap alongside product and platform priorities, and flag where a hardware decision creates or removes platform work
- Set design standards,



review checklists and revision-control discipline for the hardware function

Design

- Schematic capture and multi-layer PCB layout, including mixed RF, analog and switching-power boards (KiCad is our tool; Altium/Eagle experience transfers)
- Select and integrate sensors: MEMS accelerometers, velocity sensors, thermocouple/RTD front-ends, CT-based current sensing, temperature, humidity, gas and particulate sensing
- Design industrial power stages — wide-input DC, SMPS and LDO selection, reverse-polarity and transient protection, digital isolation on external-facing I/O, and honest power budgets for battery-operated nodes
- Design for wireless: antenna keepout discipline, external antenna routing for metal enclosures, cellular/LoRa/WiFi/BLE integration and link reliability in poor-coverage plants
- Implement industrial protocol interfaces — Modbus RTU, RS-485, SPI, I2C — and integrate with existing plant automation where required

Build

- Own the BOM: part selection, cost, lifecycle risk, second sources and availability across Indian and international distributors
- Drive PCB fabrication and SMT assembly through vendors; own Gerber, pick-and-place and BOM exports
- Work with our contract manufacturing and component partners on technical reviews, DFM and quality
- Work with mechanical/enclosure design for form factor, IP rating, cable entry, thermal path and mounting

Test

- Define and run structured bring-up: visual inspection, current-limited power-on, rail verification, thermal check
- Debug SPI/I2C/UART with a logic analyzer and scope; diagnose signal integrity, noise and grounding issues
- Validate sensors against reference instruments; define calibration and conversion to engineering units
- Run stress validation — burn-in, temperature cycling, vibration on live machinery, and link-stability testing over sustained transmit cycles
- Document it: test reports, known-issues logs, assembly guides, revision-controlled schematics and BOMs

Lead and deploy

- Mentor the hardware engineers and R&D; trainees on the team through design reviews and debugging sessions
- Hand off cleanly to firmware and platform — register maps, init sequences, addresses, conversion formulas, power budgets
- Own certification readiness: CE, RoHS, BIS,



and flag anything needing ATEX/IECEx or extended-temperature qualification
- Join customer site visits for commissioning and failure diagnosis, and feed what you learn into the next revision

Must have

- 5–8 years of fully hands-on embedded or industrial electronics design — not years spent primarily in coordination, management or documentation roles
- At least one product you personally took from schematic to units running in the field, and stayed with through its failures
- Working knowledge of at least two MCU ecosystems — ESP32, STM32, Nordic nRF, NXP, TI, Renesas, RISC-V or comparable — and the ability to justify a platform choice on the merits
- Fluent in a professional EDA tool for schematic and multi-layer layout; comfortable with 4-layer stackups mixing RF, analog and power
- Real sensor-integration depth: datasheet-level reading, interface selection, noise and grounding, calibration
- Power supply design competence — SMPS and linear, protection circuits, current budgeting
- Strong lab skill: oscilloscope, logic analyzer, DMM, bench supply, thermal imaging. You debug by measuring
- Transparent technical writing — BOMs, test reports, assembly instructions
- Comfortable on a factory floor, not only at a bench

Good to have

- Vibration analysis or condition-monitoring background (FFT, ISO 10816)
- Cellular module integration and link debugging in poor-coverage industrial sites
- Certification experience — CE, BIS, ATEX/IECEx
- 3D CAD for enclosures (Fusion 360) and DFM for FDM printing or injection moulding
- Firmware capability in C/C++ — enough to bring up your own board
- Experience designing for high-EMI, high-temperature or high-vibration environments
- Experience mentoring junior engineers or running design reviews

How we'll know you're the right person You'll be asked to walk us through a board you designed — why each major part was chosen, including the MCU, what went wrong the first time, and how you found out. We care more about that story than about your tool list.

What we offer

- Technical ownership of a product line that is already in the field and growing
- Direct reporting to the founder; short path from decision to deployed product
- Competitive compensation based on experience, plus ESOP participation
- A company with a granted Indian patent, paying industrial customers, and backing from MeitY, DST, IIT Hyderabad TBI, iCreate, ISB DLabs, NSRCEL at IIM Bangalore, BharatNext, MathWorks and Peachscore

Location: Hyderabad, Telangana — on-site, with travel to customer plants

📌 Hardware Engineer (India)
🏢 klvin.ai
📍 India