Responsibilities

- Production Management:
- Oversee Front-of-Line (FOL) operations, including back grinding, wafer mounting, dicing, die sorting, Die bonding / flip attach and wire bonding.
- Develop and implement production schedules to meet customer demands and delivery timelines.
- Ensure efficient utilization of equipment and workforce to achieve maximum productivity.
- Process Optimization &
- Continuous Improvement:
- Monitor and analyze key performance indicators (KPIs) such as yield, cycle time, and throughput.
- Drive continuous improvement initiatives using Lean Manufacturing and Six Sigma methodologies.
- Collaborate with process engineers to identify bottlenecks and improve FOL processes.
- Quality &
- Compliance:
- Ensure FOL operations meet quality standards (ISO, IATF 16949, JEDEC, etc.) and customer requirements.
- Work with the Quality Assurance team to address defects, yield losses, and process deviations.
- Maintain compliance with ESD (Electrostatic Discharge), contamination control, and cleanroom protocols.
- Equipment &
- Technology Management:
- Oversee the maintenance and calibration of FOL equipment (BG,dicing saws, die/wire bonders, wafer handling tools).
- Evaluate and implement new automation and technology solutions to enhance productivity.
- Coordinate with vendors for equipment upgrades and troubleshooting.
- Team Leadership &
- Training:
- Manage and develop a team of FOL technicians, operators, and engineers.
- Provide training and skill development to ensure high workforce competency.
- Foster a culture of safety, teamwork, and operational excellence.
- Cost Management &
- Reporting:
- Optimize operational costs by reducing material waste, improving efficiency, and controlling downtime.
- Prepare and present weekly/monthly reports on FOL performance, challenges, and improvement plans.




- Work closely with supply chain and procurement teams to ensure the availability of raw materials and tools.

Qualification Requirements

- Bachelor’s degree /Diploma holder in Engineering (Electronics, Mechanical, Industrial, or related field).
- 10+ years of experience in semiconductor OSAT or IC packaging industry, with at least 2 years in a managerial role.
- Solid knowledge of FOL processes, semiconductor manufacturing, and packaging technologies.
- Experience in advanced packaging (Flip Chip, WLP, QFN… etc).
- Experience with Lean Manufacturing, Six Sigma, and process automation.
- Proficiency in manufacturing software (MES, SPC, ERP, etc.).

Strong leadership, communication, and problem-solving skills.

Job Category: Engineering

Job Type: Full Time

Job Location: Hyderabad

Responsibilities

- Production Management:
- Oversee Front-of-Line (FOL) operations, including back grinding, wafer mounting, dicing, die sorting, Die bonding / flip attach and wire bonding.
- Develop and implement production schedules to meet customer demands and delivery timelines.
- Ensure efficient utilization of equipment and workforce to achieve maximum productivity.
- Process Optimization &
- Continuous Improvement:
- Monitor and analyze key performance indicators (KPIs) such as yield, cycle time, and throughput.
- Drive continuous improvement initiatives using Lean Manufacturing and Six Sigma methodologies.
- Collaborate with process engineers to identify bottlenecks and improve FOL processes.
- Quality &
- Compliance:




- Ensure FOL operations meet quality standards (ISO, IATF 16949, JEDEC, etc.) and customer requirements.
- Work with the Quality Assurance team to address defects, yield losses, and process deviations.
- Maintain compliance with ESD (Electrostatic Discharge), contamination control, and cleanroom protocols.
- Equipment &
- Technology Management:
- Oversee the maintenance and calibration of FOL equipment (BG,dicing saws, die/wire bonders, wafer handling tools).
- Evaluate and implement new automation and technology solutions to enhance productivity.
- Coordinate with vendors for equipment upgrades and troubleshooting.
- Team Leadership &
- Training:
- Manage and develop a team of FOL technicians, operators, and engineers.
- Provide training and skill development to ensure high workforce competency.
- Foster a culture of safety, teamwork, and operational excellence.
- Cost Management &
- Reporting:
- Optimize operational costs by reducing material waste, improving efficiency, and controlling downtime.
- Prepare and present weekly/monthly reports on FOL performance, challenges, and improvement plans.
- Work closely with supply chain and procurement teams to ensure the availability of raw materials and tools.

Qualification Requirements

- Bachelor’s degree /Diploma holder in Engineering (Electronics, Mechanical, Industrial, or related field).
- 10+ years of experience in semiconductor OSAT or IC packaging industry, with at least 2 years in a managerial role.
- Strong knowledge of FOL processes, semiconductor manufacturing, and packaging technologies.
- Experience in advanced packaging (Flip Chip, WLP, QFN… etc).
- Experience with Lean Manufacturing, Six Sigma, and process automation.
- Proficiency in manufacturing software (MES, SPC, ERP, etc.).

Strong leadership, communication, and problem-solving skills.

📌 Front-of-Line (FOL) Manager (Hyderabad)
🏢 ASIP Technologies
📍 Hyderabad