About BytebeamBytebeam builds the hardware and software stack for connected vehicles. Our products bring together in-vehicle devices, telemetry, remote diagnostics, OTA updates, alerts, and fleet-scale device management so customers can deploy and operate connected products reliably in the field.

Bytebeam's driver monitoring system is an integrated video-telematics product for commercial fleets. It combines road-facing video, in-cabin driver monitoring, edge intelligence, vehicle data, location, connectivity, and cloud workflows to help fleets understand risk and improve driver safety.

Role OverviewWe are hiring a hands-on Hardware Lead to own the electrical and electronic system for our driver monitoring system from architecture through production and field reliability.

You will lead the technical work across cameras, optics, edge compute, memory and storage, cellular and GNSS, vehicle interfaces, automotive power, RF, thermal design, and manufacturing test. You will work closely with firmware, computer vision, mechanical, cloud, product, validation, manufacturing, and fleet-operations teams so the complete device works reliably in real vehicles, not only on a bench.

This is a technical leadership role for a player-coach. You will run architecture and design reviews, plan execution, mentor engineers, and drive cross-functional issues to closure while staying close to schematics, layouts, bring-up, measurements, and failure analysis. The broader Hardware Engineering Manager owns organization-level people management.

What You'll Do (Ownership Areas)1. System and Hardware Architecture

- Own the driver monitoring system's electrical architecture, subsystem requirements, interface definitions, component strategy, and hardware roadmap.
- Make evidence-based tradeoffs across camera quality, edge compute, memory, storage, thermal headroom, power, bandwidth, cost, manufacturability, and field life.
- Lead design decisions for road-facing and in-cabin cameras, application processor or AI SoC, LPDDR, eMMC/UFS/SD storage, LTE, GNSS, Wi-Fi/Bluetooth, CAN/OBD, IMU, audio, and service/debug interfaces.
- Review schematics, PCB placement and routing, power integrity, signal integrity, RF/antenna implementation, grounding, shielding, stack-up, and component derating.

2. Camera and DMS Hardware Readiness
- Own sensor, lens, field-of-view, HDR/WDR, IR illumination, MIPI CSI, ISP, synchronization, calibration, and mechanical-interface requirements with computer-vision and mechanical teams.
- Build an image-quality and camera-readiness plan covering day, night, glare, low light, occlusion, driver position, windshield angle, installation tolerance, and vehicle variation.
- Ensure the hardware delivers stable, correctly timed, and diagnostically useful inputs for DMS and road-scene models; partner with the AI team on model performance rather than owning model development.
- Design for camera privacy, tamper resistance, serviceability, health monitoring, and controlled access to recorded data.

3.

Automotive

Power, Connectivity, and Reliability
- Design for crank, load dump, reverse polarity, jump start, ignition transitions, sleep and parking modes, brownouts, battery protection, and graceful recovery.
- Own cellular, GNSS, Wi-Fi/Bluetooth, CAN/OBD, antenna,



and RF performance across realistic vehicle and installation conditions.
- Define and close DVP&R; coverage for thermal cycling, high cabin temperature, vibration, shock, ESD, EMI/EMC, RF coexistence, storage endurance, power interruption, and long-duration operation.
- Make field failures diagnosable through hardware telemetry, health signals, logs, test points, recovery mechanisms, and controlled fault injection.

4. Bring-Up and System Debug
- Lead board bring-up, interface validation, camera tuning support, power and thermal characterization, and hardware/firmware integration.
- Debug issues across analog, power, high-speed digital, RF, image pipeline, storage, embedded Linux or Android BSP, drivers, boot, and vehicle interfaces.
- Use oscilloscopes, logic analyzers, protocol analyzers, power analyzers, spectrum or network analyzers, thermal tools, and camera test setups to reach root cause.
- Run design reviews, failure reviews, technical risk reviews, and release-readiness reviews with clear owners and closure criteria.

5. NPI, Manufacturing, and Suppliers
- Take hardware through prototype, EVT, DVT, PVT, pilot fleet, and mass-production gates.
- Lead component vendors, camera-module and lens suppliers, ODM/JDM/EMS partners, antenna partners, and external test labs on technical issues.
- Own DFM, DFA, DFT, tolerance analysis, alternate-part qualification, component lifecycle risk, and hardware change control.
- Define end-of-line functional test, programming, current-consumption checks, camera calibration and image checks, RF or connectivity checks, traceability, and production limits.
- Drive yield improvement, RMA analysis, 8D/root-cause closure, corrective action, and design feedback from fleet deployments.

6.

Technical

Leadership and Delivery
- Break product requirements into hardware plans, estimates, dependencies, validation gates, and release criteria.
- Mentor hardware engineers and raise the bar for design quality, documentation, reviews, laboratory practice, and decision-making.
- Partner with firmware, AI, mechanical, product, cloud, quality, supply-chain, and field teams to resolve system-level tradeoffs.
- Communicate risks early and make clear recommendations on architecture, schedule, cost, quality, and production readiness.

Deliverables You'll Own
- Hardware architecture, subsystem specifications, interface control, and design-review closure
- Released schematics, layout-review inputs, BOM decisions, and component-risk plan
- Camera and image-quality hardware readiness, including calibration and production-test requirements
- Bring-up plan, DVP&R;, compliance inputs, validation evidence, and hardware release recommendation
- EVT/DVT/PVT exit evidence, manufacturing-test coverage, yield dashboard, and ramp issue closure
- Field-failure RCA, corrective actions, reliability improvements, and next-revision roadmap
- Hardware execution plan, technical risk register, engineering documentation, and mentoring outcomes

Must-Have Skills




- 8+ years of hands-on embedded hardware development, including technical leadership on at least one connected camera, edge-compute, automotive electronics, or similarly complex production device.
- Shipped at least one hardware product from architecture and detailed design through validation, production ramp, and field support.
- Strong schematic design and review capability across high-speed digital, mixed-signal, power, and RF-connected systems, plus the ability to guide multilayer PCB layout.
- Experience with camera sensors or modules, MIPI CSI, image signal pipelines, sensor timing, lens/FOV decisions, IR or low-light operation, and image-quality validation.
- Experience with application processors or AI SoCs, LPDDR, eMMC/UFS/SD storage, boot and debug architecture, and storage or power-failure behavior.
- Hands-on experience with at least one camera or edge-AI platform from Ambarella, Qualcomm, NVIDIA, NXP, Texas Instruments, or a comparable vendor.
- Strong automotive power, cellular/LTE, GNSS, CAN, EMI/EMC, ESD, thermal, vibration, and environmental-reliability fundamentals.
- Working fluency with UART, SPI, I2C, USB, CAN, audio, GPIO, and common hardware/firmware debug workflows.
- Hands-on laboratory debugging and disciplined root-cause analysis at board, system, manufacturing, and field levels.
- Experience with EVT/DVT/PVT, DFM/DFA/DFT, factory test, suppliers or EMS partners, yield, and engineering change control.
- Clear technical communication, review leadership, mentoring ability, and the judgment to balance quality, cost, schedule, manufacturability, and customer impact.

Good-to-Have
- Embedded Linux or Android BSP, bootloader, driver, secure boot, encrypted storage, OTA, and remote-diagnostics exposure.
- Automotive validation experience with relevant parts of CISPR 25, ISO 7637-2, ISO 11452, ISO 16750, or customer-specific requirements.
- AIS-140, India radio/cellular approvals, carrier certification, or similar market-certification experience.
- Familiarity with DMS/ADAS hardware validation, camera calibration targets, computer-vision input quality, and privacy-by-design.
- Experience with high-volume connected devices, automated HIL rigs, environmental stress screening, HALT, or reliability growth programs.
- Exposure to functional safety, cybersecurity engineering, or ASPICE where the product or customer program requires it.

Who We Are Looking ForYou reason about the complete deployed device. A camera that looks positive in the lab but fails under windshield glare, a modem that loses performance after installation, storage that corrupts during a power event, or a board that cannot be tested repeatably at the factory are all hardware problems worth owning. You should be comfortable moving between architecture, a schematic review, bench measurements, a supplier call, a fleet issue, and a release decision. You bring structure to ambiguous system problems, make tradeoffs visible, and stay with issues until the evidence supports closure.

Application Note

- Along with your resume, describe one connected camera, telematics, edge-AI, or automotive device you helped ship. State what you personally owned, the hardest failure you encountered, how you proved the root cause, and what changed before production or in the next revision.

📌 Hardware Lead - Driver Monitoring System and Video Telematics (Bengaluru)
🏢 Bytebeam
📍 Bengaluru