SoC HW Systems Engineer — Packaging (Bengaluru)

SoC HW Systems Engineer — Packaging (Bengaluru)

20 Aug
|
infineon
|
Bengaluru

20 Aug

infineon

Bengaluru

Our Automotive Microcontroller R&D; team is looking for an experienced SoC HW Systems Engineer to join the Chip-Level Architecture team and own the package, ballout, and IO interface strategy for our next-generation automotive microcontroller platform.

Your role
Key responsibilities in your new role

· Own the package selection strategy, ballout architecture, and IO ring planning for our next-generation uC platform.
· Analyze and consolidate customer PCB design constraints and system-level integration requirements to drive chip-level packaging decisions.
· Review and maintain the platform ballout map, providing technical feedback across stakeholder teams including implementation, PHY vendors, and customers.
· Drive the datasheet content for IO electrical parameters and system-level interface specifications in collaboration with IP teams and customers.
· Verify PHY and PMIC compatibility with the platform through model-based simulation and parasitic analysis.
· Assess package performance vs.



cost tradeoffs and maintain the holistic picture of package constraints versus customer system needs across the full product family.
· Maintain technical documentation in compliance with ISO 26262 requirements.

Your profile
Qualifications and skills to help you succeed

· Bachelor's or Master's degree in Electrical Engineering or related field.
· At least 7 years of industry experience in semiconductor product development with a background in analog design, package engineering, or SoC system-level design.
· Positive knowledge of package types (LFBGA, TFBGA, QFP) and package parasitic modeling.
· Experience with PCB system-level design constraints and customer board integration requirements.
· Understanding of IO ring architecture — pad types, ESD protection strategies, IO power domains.
· Familiarity with ballout planning, signal grouping principles, and PCB routing constraints for automotive microcontrollers.
· Familiarity with ISO 26262 documentation standards.
· Pro-active collab

📌 SoC HW Systems Engineer — Packaging (Bengaluru)
🏢 infineon
📍 Bengaluru

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