- Develop new packages and processes to support new product launches on time. (50%)
- Carry out Packaging Design for new products, feasibility studies with Assembly subcons, Risk Assessments and develop Gantt charts for projects. (30%)
- Troubleshoot and Support production related packaging issues. (20%)
- Designing new packages, layout of lead frame and substrate panels.
- Run risk analyses for new product scenarios.
- Debug subcon production issues.
- Make design and process decisions to achieve best in class recent product realization.
Minimum Qualifications
- B.Sc. ENG.
Preferably
Masters with major in Materials Science or Electrical Engineering
- 8 to 10 years of experience working in packaging industry either for assembly subcon or as a designer in New Product Team
- Excellent analytical and trouble shooting skills with the ability to proactively solve issues
- Effective verbal and written communication to interface at all levels within the organization
- Strong sense of urgency to meet product requirements on schedule
- Experience in working with international and cross-functional teams
- AutoCAD package design is required. SolidWorks and Thermal simulations are plus.
- Proficiency in Microsoft Office™ products - Excel, Word, Visio, Power Point, Project