The Chip Lead at HCLTech will drive end-to-end SoC/ASIC programs for global customers, owning delivery, customer engagement, and technical leadership. The role combines deep VLSI expertise with strong program management and business-facing responsibilities.
Key Responsibilities:
Own end-to-end chip program delivery for customer engagements (architecture to silicon bring-up)
Act as primary technical interface to customers, driving trust, reviews, and escalations
Lead cross-functional teams across:
RTL Design
Verification (UVM-based)
Key Responsibilities
Physical Design (PnR, STA, Signoff)
DFT and integration
Drive program planning, estimation, and execution in a services environment
Ensure adherence to schedule, quality, and PPA (Power, Performance, Area) targets
Manage risk, dependencies, and change requests in energetic customer programs
Support pre-sales and solutioning:
Effort estimation
Proposal reviews
Technical win support
Skill Requirements
Enable scaling of teams (onsite-offshore model) and optimize utilization
Lead tapeout readiness reviews and post-silicon debug coordination
Required Skills & Experience:
12-16 years in VLSI / SoC development
Proven experience leading customer-facing chip programs