Wafer Bumping & Advanced Packaging Materials Supply Chain Lead
The Wafer Bumping SCM Lead will be responsible for the end-to-end sourcing strategy, supplier selection, technical-commercial evaluation, procurement, qualification support, and lifecycle management of wafer bumping equipment, materials, and services. The role requires deep expertise in semiconductor equipment sourcing and robust knowledge of wafer bumping manufacturing technologies to enable informed sourcing decisions, supplier negotiations, technology benchmarking, and capacity planning.
The position will lead sourcing activities for greenfield factory setup, technology transfer, NPI, and high-volume manufacturing expansion while partnering closely with Process Engineering, Manufacturing, Facilities, Quality, and Finance teams.
Key Responsibilities
Equipment Strategy & Technology Selection
• Lead sourcing and selection of wafer bumping equipment and material.
• Develop equipment/material sourcing strategies aligned with technology roadmap and factory expansion plans.
• Support make-versus-buy and technology selection decisions through technical and commercial evaluations.
• Conduct supplier benchmarking and technology assessments across global OEMs.
• Drive RFQ, RFI, technical reviews, commercial negotiations, and supplier down-selection activities.
Equipment Categories
Responsible for sourcing and qualification support of:
• Wafer Cleaning Systems
• Photoresist Coaters & Developers
• Lithography Steppers / Aligners
• Sputtering & UBM Deposition Systems
• Electroplating Equipment
• Ball Placement / Ball Drop Systems
• Reflow Furnaces
• Wafer Grinding Systems
• Wafer Dicing Systems
• AOI & Inspection Systems
• Metrology Equipment
• SEM / FA Equipment
• Reliability Test Equipment
• Material Handling & Automation Systems
• MES / Industry 4.0 Integration Interfaces
Supplier Management & Commercial Leadership
• Establish strategic partnerships with leading semiconductor equipment suppliers.
• Lead comp