Responsibilities:

- Responsible for the development of materials required for OSAT Package Technology Development
- Expertise in understanding semiconductor package materials, equipment and processes and have an established wide network of suppliers and contacts in the industry.
- Need to work closely with development teams to develop the most profitable packaging solutions with right material selection.
- Evaluate and select materials for packaging, focusing on their compatibility with the packaging technology, while considering cost constraints.
- Knowledge and experience in managing die to package interactions.
- Drive cost reduction programs and yield improvement programs
- Identifying industry packaging trends, working with the Business Units to develop the required materials.
- Liaise with materials and equipment suppliers, understand and influence roadmaps and narrow down packaging solutions & drive competitive analysis.
- Able to quickly become acquainted with new topics and build lasting relationships with the Cross-functional teams and external counterparts.
- Knowledge in materials characterization and analysis
- General understanding of packaging technologies, assembly processes, IC packaging materials, reliability standards, FA techniques, etc.
- Good program management skills.

Essential Attributes:





- Valuable understanding of Advanced Packaging architecture and semiconductor packaging process flow.
- Knowledge on Packaging Assembly Process (Back Grinding, Dicing, Die Attach, Wire Bonding, Moulding, P&P;, Ball Attach, Trim & Form, Singulation).
- Ability to work well in a cross-functional environment on challenging projects.
- Experience in package material characteristics and interfacial bonding.
- Able to perform independent research and development work.
- Excellent written and verbal communication skills with ability to present ideas, design concepts, data and plan with high confidence at team meetings.

Qualifications:

- Bachelor or Master Degree in chemical, Mechanical, or Materials Science Engineering.

Desired Experience Level:

- Minimum 5+ years of experience in semiconductor package simulations.

Disclaimer: This job posting has been aggregated from external source. Role details, content, and availability are subject to change. Applicants are advised to confirm the latest information directly on the company website before applying.

Disclaimer: The job location mentioned in this description is based on publicly available information or company headquarters. Role details, content, and availability are subject to change. Applicants are advised to confirm the latest information directly on the company website before applying.

📌 IC Technology Development Material Characterisation Engineer (Pune)
🏢 U3 Infotech Pte
📍 Pune