About the Role:

As the Lead of Wire Bonding, you will be responsible for overseeing and leading the wire bonding operations within a semiconductor manufacturing facility. Your role involves managing the wire bonders, implementing process improvements, ensuring quality standards, and collaborating with other departments to achieve overall production goals.

Key Responsibilities:

- Handson experience in FOL or EOL process within semiconductor industry, with a proven track record of accomplishment.
- In-depth knowledge of any single /multiple process related to process and equipment.
- Set up and operate FOL or EOL equipment according to established procedures.
- Lead and manage the wire bond team, providing guidance, coaching, and support.
- Foster a collaborative and high-performance work environment within the department.
- Conduct inspections of wire bonds to ensure they meet quality standards and specifications.
- Troubleshoot and resolve issues related to process or equipment, collaborating with CFT teams when necessary to enhance efficiency, quality and yield.
- Maintain accurate records of production activities, including process parameters, equipment settings, and quality control data.
- Contribute to the creation and updating of standard operating procedures (SOPs) related to wire bonding processes.
- Collaborate with program manager and deliver reports on time.
- Establish and enforce quality control measures for wire bonding operations.
- Ensure compliance with industry standards and customer specifications.




- Develop and implement strategic plans for the wire bonding department in alignment with overall organizational goals.
- Identify opportunities for cost savings, productivity enhancements, and technological advancements.
- Collaborate with other department heads, including engineering, production, and quality assurance, to achieve seamless integration of processes.
- Communicate effectively with stakeholders to address challenges and optimize workflows.
- Identify and address skill gaps within the team.
- Ensure accurate documentation of wire bonding processes, equipment settings, and quality control data.
- Communicate effectively with team members to address issues and drive continuous improvement.
- Generate reports on departmental performance and key metrics.

Essential Attributes:

- Solid analytical and problem-solving skills.
- Excellent communication and interpersonal skills.
- Demonstrated ability to lead and motivate a diverse.

Qualifications:

- Bachelor s degree in mechanical, Electronics or Electrical or Industrial engineer.

Desired Experience Level:

- Minimum 5 years of experience in semiconductor manufacturing.

Disclaimer: This job posting has been aggregated from external source. Role details, content, and availability are subject to change. Applicants are advised to confirm the latest information directly on the company website before applying.

Disclaimer: The job location mentioned in this description is based on publicly available information or company headquarters. Role details, content, and availability are subject to change. Applicants are advised to confirm the latest information directly on the company website before applying.

📌 IC Technology Development - Process & Packaging SME (Pune)
🏢 U3 Infotech Pte
📍 Pune