Responsibilities:

- Responsible for the technology and process development for the Flip Chip product packaging engineer.

FOL: Back grinding, Laser groove, Mechanical sawing, SMT & Flip Chip Attach, Mass Reflow/TCB/Flux less, Flux Cleaning, Plasma Clean, Underfill and

EOL: Mold Underfill, Ball Attach, Saw Singulation, O/S, FVI, Pick and Place & Packing.

- Understand, integrate and innovate to meet customers packaging requirements into a cost competitive DFM solution.
- Initiate and engage in technical discussion with vendors to gather all relevant data, review and complete the initial analysis for final decision submission.
- Involvement in the selection of 4Ms based on latest performance and previous experience/learnings.
- Install, buy-off and qualify the given processes and products for development, NPI and LVM.
- Continuous Strive for meeting highest degree of packaging difficulty, ease of DFM to meet BEST customer desired outputs, best in class Yield, best Quality in the industry.
- Offer wide range of BOM selection to cater to different customer requirement.
- Execution of multiple department projects.




- Identify all process controls requirements and use the BKM for inputs & outputs data gathering/controls.

Essential Attributes:

- Exposure in MS office, 8D writing, DOE, SPC, FMEA, OCAP and Control Plan.
- Passionate in achieving what s not possible via innovation and continuous learning.

Qualifications:

- A minimum relevant engineering or Science degree.

Desired Experience Level:

- Minimum of 4 years of total experience for Sr Engineer and 10 years for Manager.
- Experience in leading a group or team of employees in the achievement of organizational goals.

Disclaimer: This job posting has been aggregated from external source. Role details, content, and availability are subject to change. Applicants are advised to confirm the latest information directly on the company website before applying.

Disclaimer: The job location mentioned in this description is based on publicly available information or company headquarters. Role details, content, and availability are subject to change. Applicants are advised to confirm the latest information directly on the company website before applying.

📌 Flipchip Engineer (Pune)
🏢 U3 Infotech Pte
📍 Pune