Responsibilities:

- Collect requirements from sales and FAE.
- Perform BOM costing for RFQ to customer.
- Work with SME to collect CAPEX and tooling requirements.
- Collect UPH estimation for costing purpose from SMEs.
- Develop database for BOM costing referencing to speed up cycle time.
- Able to communicate with both internal and external stakeholders.
- Update BOM and co-ordinate with team to implement in SAP system.

Essential Attributes:

- Knowledge in wire bond diagram /netlist.
- Working knowledge in logical net-listings, schematics usage, electrical and routing rules creation.
- Good understanding & knowledge on Advanced Packaging architecture and semiconductor packaging process flow (Back Grinding, Dicing, Die Attach, Wire Bonding, Molding, P&P;, Ball Attach, Trim & Form, Singulation).
- Solid presentation skills with excellent networking skills.
- Excellent English communication to work with a diverse cross-functional culture.
- Willing to tackle tough problems and enjoy problem solving.



Comfortable in large corporate environments and can work with multi-functional teams across geographies.

Qualifications:

- Bachelor Diploma / degree in Mechanical or Materials Science or electronics Engineering.

Desired Experience Level:

- Minimum 3+ years of experience in semiconductor packaging & substrate designing.

Disclaimer: This job posting has been aggregated from external source. Role details, content, and availability are subject to change. Applicants are advised to confirm the latest information directly on the company website before applying.

Disclaimer: The job location mentioned in this description is based on publicly available information or company headquarters. Role details, content, and availability are subject to change. Applicants are advised to confirm the latest information directly on the company website before applying.

📌 IC Technology Development BOM and Costing Manager (Pune)
🏢 U3 Infotech Pte
📍 Pune