22 Oct
|
Thanu Associates
|
Bengaluru
22 Oct
Thanu Associates
Bengaluru
Qualifications
Minimum Qualifications
6+ years of hands‑on experience in package CAD layout and development.
Robust experience with 2.5D / 3D IC packaging, FCBGA and advanced substrate‑based packages, multi‑die and chiplet‑based designs.
Proficiency in industry‑standard tools such as: Cadence Allegro Package Designer (APD / SiP), Siemens Xpedition / Innovator 3D IC, or equivalent.
Experience working with advanced manufacturing design rules and interface with OSATs.
Valuable understanding of Signal Integrity (SI) and Power Integrity (PI) fundamentals and High‑Speed Design concepts.
Strong communication, presentation, and documentation skills with the ability to work effectively in a team workplace.
Pay: ₹100,000.00 - ₹300,000.00 per month
Work Location: In person
📌 Staff Package Design Engineer Bengaluru
🏢 Thanu Associates
📍 Bengaluru